Industry News | 2016-06-27 14:59:09.0
GPD Global introduces the NEW TempView Thermal Imaging System that ensures the success of heated dispensing processes like Underfill, Encapsulations, Dam and Fill, and more. The TempView Thermal Imaging System monitors the temperature of the entire substrate for complete heat profile characterization. Regions of the product may be selected for monitoring during the heating process. Now you can accurately monitor temperature of specific devices to be sure they are up to temperature before starting a process.
Industry News | 2016-12-09 23:33:42.0
GPD Global offers advanced dispense pump technologies to upgrade your existing platform and take advantage of existing capital equipment. Retrofit your system with innovative dispensing technology for excellent dispense control and repeatability.
Industry News | 2016-08-25 17:56:34.0
GPD Global's advanced Precision Auger Pump retrofits into your dispensing system to provide excellent dispense control and repeatability. Precision Auger Pump Integration provides your process development with a broad range of functionality.
Industry News | 2021-04-29 17:19:42.0
ASYMTEK Forte™ MAX offers dual jetting with real-time skew correction for faster, enhanced, automated fluid dispensing
Industry News | 2016-03-09 16:11:24.0
Presenting "A Review of Jetting Technologies for Fluid Dispensing: Identifying the Features that Influence Productivity" on March 17, 2016, at 10:30 AM.
Industry News | 2019-09-25 16:22:29.0
Nordson ASYMTEK announces that it has celebrated 20 years of supplying fluid dispensing equipment to Demant A/S, a world-leading manufacturer of hearing aid brands that include Oticon, Bernafon, and Sonic. During this history, Nordson technologies have enabled Demant to design smaller and more capable hearing aids.
Industry News | 2016-10-04 19:16:23.0
Engineered Material Systems is pleased to debut its 640-35 (dam) and 640-46 (fill) dam and fill UV cured chip encapsulants for chip-on-board smart card applications.
Industry News | 2012-02-22 01:32:21.0
Engineered Material Systems introduces its DE-7826 (dam) and CE-7826 (fill) Dam and Fill Chip Encapsulants for chip-on-board (COB) applications.
Industry News | 2020-06-11 06:23:00.0
Essemtec announces that its Spider smart-sized high-speed dispenser can be adapted for a wide range of dispensing applications including solder paste and SMT glue, LED encapsulation, silver epoxy, dam and fill, underfill, cavity fill, 3D dispensing via laser height mapping and more.
