Industry News: defect escaped % (Page 1 of 6)

NEMI's Test Strategy Project Releases Cost Model

Industry News | 2003-05-22 08:54:17.0

Allows PCA Manufacturers to Compare Costs of Alternative Test Strategies

SMTnet

IPC Issues Electronics Industry Warning on Printed Board Microvia Reliability for High Performance Products

Industry News | 2019-03-10 20:30:11.0

The proliferation of tighter microvia densities and signal integrity requirements in printed boards within the electronics industry has revealed reliability concerns with microvia structures in high performance products. A number of IPC OEM member companies have approached IPC with examples of microvia failures in high-profile hardware that were not observed until after bare printed board fabrication, inspection and acceptance, including:

Association Connecting Electronics Industries (IPC)

How to Prevent Solder Ball and Bridging Defects during the SMT Reflow Process

Industry News | 2018-10-18 08:32:52.0

How to Prevent Solder Ball and Bridging Defects during the SMT Reflow Process

Flason Electronic Co.,limited

Kester’s Peter Biocca to Chair AOI and X-Ray Inspection Technical Session at SMTAI 2010

Industry News | 2010-10-04 17:03:39.0

Kester announces that Peter Biocca, Senior Market Development Engineer, will Co-Chair Session PRC2, titled “Strategies for Optimizing AOI and X-Ray Inspection” at the upcoming SMTA International, scheduled to take place October 24 - 28, 2010 at the Walt Disney World Swan and Dolphin Resort in Orlando, FL. The session will take place Wednesday, October 27, 2010 from 10:30 a.m.-12 p.m. in room Europe 1.

Kester

Semiconductor Defect Density and Time-to-Market Improved with New Teradyne Toolset

Industry News | 2015-04-03 16:02:29.0

The Oasis Toolset is designed to address the unique test challenges posed by complex semiconductor devices.

Teradyne

Teradyne Introduces IG-XL Real Time Audit Tool To Drive Higher Test Program Quality

Industry News | 2015-04-03 16:04:35.0

New Real Time Audit (RTA) Tool for the UltraFLEX platform.

Teradyne

Viscom Introduces the New Software Release SI 7.47

Industry News | 2014-07-24 10:09:05.0

With this new Release, Viscom introduces numerous innovations and improvements in the area of inspection plan generation and analysis software for its inspection systems.

Viscom AG

Nordson DAGE’s Evstatin Krastev, Ph.D. to present at SMTA International 20132D/3D X-Ray Inspection: Process Control and Development Tool technical paper to be discussed

Industry News | 2013-09-16 14:19:30.0

Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN) is delighted to announce that Evstatin Krastev, Ph.D., partnered with Zhen (Jane) Feng, Ph. D., Tho Vu, Michael Xie, David A. Geiger and Murad Kurwa of FLEXTRONICS International Inc., and Zohair Mehkri of Santa Clara University, will be presenting their paper titled, “2D/3D X-Ray Inspection: Process Control and Development Tool” during technical session PRC2 Imaging, Inspection and Quality at the upcoming SMTA International in Fort Worth Texas.

Nordson DAGE

Koh Young Intros New Platform KY8030-3 SPI at SMTAI

Industry News | 2013-09-10 13:21:08.0

Koh Young will exhibit new SPI and AOI measurement technology at the upcoming SMTAI conference and exhibition in Fort Worth, Texas, in Booth #136

Koh Young America, Inc.

BSU Inc. Updates High-Performance X-ray Inspection Capability

Industry News | 2021-05-10 02:50:10.0

BSU Inc. has updated its high-performance X-ray inspection capability with the installation of a Nikon XT V Series world-class X-ray and CT inspection system. In addition to inspecting many areas of SMT/PCB assemblies that are generally inaccessible to visual inspection, the new X-ray system will be used to inspect Ball Grid Array (BGA), leadless, and connector components to identify problems such as solder joint defects, shorts, opens, etc...

BSU Incorporated

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