Industry News | 2017-03-22 13:56:25.0
Engineered Material Systems is pleased to debut its 631-39 UV plus thermal cured adhesive for bonding lens holders in camera module applications.
Industry News | 2017-04-22 11:52:53.0
Engineered Material Systems is pleased to introduce the DF-4014 dry-film negative photoresist for use in micro-electro mechanical systems (MEMS), wafer-level packaging and CMOS applications (TSV sealing). This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.
Industry News | 2017-05-22 11:40:48.0
ADLINK Technology has successfully introduced its OpenSled specification, contributing to the evolution of the next generation of appliances that fit into the Open Compute Project (OCP) CG-OpenRack-19 specification.
Industry News | 2017-10-18 20:37:52.0
Engineered Material Systems is pleased to debut its 631-68 UV plus thermal cured adhesive for bonding lens holders in camera module applications.
Industry News | 2018-01-28 20:07:34.0
Engineered Material Systems is pleased to debut its 506-03A/B, which is a two-component epoxy system with a convenient 1:1 volumetric mix ratio designed to pass rigorous reliability requirements.
Industry News | 2018-02-10 06:10:03.0
Clearwater, FL - Solderstar, will be showcasing its full range of smart thermal profiling solutions at the IPC Apex Expo, held in San Diego between February 27th – March 1st 2018. The Solderstar systems feature the innovative ‘Smartlink’ connection system that allows one datalogger to be used with a range of intelligent fixtures
Industry News | 2018-03-12 17:42:02.0
Engineered Material Systems is pleased to debut its DA-6010 Non-Conductive Die Attach Adhesive designed for image sensor attach or chip on board applications.
Industry News | 2018-09-05 20:16:30.0
Engineered Material Systems debuts CA-188-1 low-temperature cure electrically conductive adhesive for die attach and general circuit assembly applications.
Industry News | 2019-06-15 22:32:38.0
EMS introduces a revolutionary improvement in durability for printed electronics. EMS inks and adhesives have been designed for compatibility in chemistry and mechanical stress. The unique stack-up design channels paste placement for fillet strength and higher yield with smaller devices.
Industry News | 2019-07-17 19:41:42.0
KIC announced that Miles Moreau, Global Manager Products and Technologies, will present at the SMTA Queretaro Expo & Tech Forum, scheduled to take place Thursday, August 15, 2019 at the Misión Grand Juriquilla in Queretaro, Mexico. Moreau will present “Traceability in Electronics Manufacturing: The value in transforming to digital, demonstrated on reflow and wave soldering processes.”
