Industry News: definiton of ultra fine pitch (Page 1 of 1)

ESSEMTEC to Highlight Range of Equipment at APEX 2010

Industry News | 2010-03-24 13:19:39.0

Glassboro, NJ — Essemtec, a leading manufacturer of surface mount technology production equipment, announces that it will feature a range of new equipment in booth 1059 at the upcoming IPC/APEX conference and exhibition, scheduled to take place April 6-8, 2010 at the Mandalay Bay Resort & Convention Center in Las Vegas.

ESSEMTEC AG

An Analysis of SMT Solder Paste Printing Defects

Industry News | 2018-10-18 08:27:03.0

An Analysis of SMT Solder Paste Printing Defects

Flason Electronic Co.,limited

BPM Microsystems Now Supports Lattice’s iCE40 Family of FPGAs

Industry News | 2013-10-28 16:52:14.0

BPM Microsystems is pleased to announce support for the iCE40 family of FPGAs from Lattice Semiconductor Corporation (NASDAQ: LSCC). The iCE40 FPGA family is supported on BPM Microsystems’ 7th and 8th Generation platforms, the most versatile and universal programming solutions on the market today.  

BPM Microsystems, Inc.

Viscom’s S3088 SPI Will Be Part of the NPL Solder Paste and Solder Joint Automatic Inspection Experience at SMTAI

Industry News | 2015-09-23 16:47:32.0

Viscom announced today that its S3088 SPI system will be featured in the SMTA International – National Physical Laboratory (NPL) Defect Database Live Solder Paste and Solder Joint Automatic Inspection Experience from Sept. 29-30, 2015 on the show floor. This year's special feature area will include live printing ultra-fine pitch deposits, 0201 and 01005 devices, inspection and measurement of different combinations of materials, plus some of the key in-process inspection steps to make a process perform correctly.

Viscom AG

DEK prepares to launch one of its most significant technology breakthroughs to date at exclusive webinar

Industry News | 2010-09-02 11:08:19.0

The DEK team is currently preparing for the launch of its new ProActiv technology, being billed as one of the company’s most important technology breakthroughs of recent years. To support the launch, DEK will be highlighting ProActiv’s ability to revolutionize paste transfer efficiency with an exclusive webinar being held on 24th and 27th September 2010. Participants can choose from six seminar sessions being held in different languages and at different dates and times.

ASM Assembly Systems (DEK)

PACE Offers 10 Free Nozzles with the Purchase of New TF 1800 BGA Rework System

Industry News | 2016-10-26 14:55:50.0

Vass, NC – Sept 20, 2016 – PACE Worldwide announces an introductory promotion in conjunction with the launch of their new TF 1800 BGA/SMD Rework System, which began shipping in October. For a limited time, PACE will provide 10 Heat Focusing Nozzles free of charge with the purchase of each TF 1800 System, a value of over $3,400 (£2,700/€3,340).

PACE Worldwide

Koh Young Technology to Demo New Level of Connectivity at NEPCON China 2018

Industry News | 2018-04-24 21:17:46.0

Shanghai, China - Under the slogan “True 3D now powered by AI Platform,” Koh Young Technology will highlight its latest connectivity KSMART Process Optimizer (KPO) for optimizing printers in booth 1B60 at NEPCON China from 24-26 April,2018. Pursuing AI-driven automation, Koh Young has been working with its KSMART partners like MPM printer line and EKRA printer line to realize machine connectivity and a zero-defect production line.

Koh Young America, Inc.

Wave of innovation at productronica fair - LPKF presents four new systems in Hall B2, Booth 105

Industry News | 2013-09-10 19:39:14.0

The productronica is an important trade fair for LPKF Laser & Electronics AG. In time for the opening, the specialist in micro-material processing presents four new systems and procedures

LPKF Laser & Electronics

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