Industry News | 2010-05-11 14:53:59.0
DEK is preparing to take a whole host of innovative technologies to this year’s SMT/Hybrid/Packaging exhibition, being held in Nuremberg from 8th – 10th June 2010. Stand 7-305 will showcase DEK’s productivity-boosting solutions, from powerful print platforms through to next-generation stencil technologies and Process Improvement Products.
Industry News | 2008-04-09 14:30:19.0
For electronics industry specialists who want the most advanced and cost-effective materials deposition technologies available, DEK is a sure bet. Over the three days at APEX in Las Vegas last week, DEK�s leadership position was again confirmed as the mass imaging front runner earned three top industry honors.
Industry News | 2010-03-15 11:49:19.0
Screen printing leader DEK Solar has revealed a range of technologies designed to provide advanced support for specialist photovoltaic applications. In addition to the dedicated PV1200 and PV3000 solar platforms, DEK’s specialist platforms meet the requirements of diverse PV challenges – from large-scale production to flexible or non-standard substrates.
Industry News | 2021-07-22 15:00:19.0
Technology leader ASM will present its latest innovations for the electronics manufacturing industry in a livestream on September 1, 2021. "ASM Impact – Release Summer 2021" will focus mostly on process improvements across the whole spectrum ranging from printing, inspection and placement to fully integrated software solutions. Examples include enhancement for DEK TQ and DEK NeoHorizon solder paste printers as well as for the AMS ProcessLens SPI system, along with new, smart SIPLACE feeder solutions. The event will also feature new functions and enhancements for the ASM Works smart factory suite. Another highlight will be the extensive capabilities of the ASM Factory Equipment Center solution for company-wide and non-proprietary asset and maintenance management. For more details about the event and to register, visit https://asm-smt-events.com/.
Industry News | 2019-11-05 22:19:03.0
> News-Blog > Guideline for wire bonding Guideline for wire bonding Tuesday,Jun 12,2018 There are two wire bonding processes that are used, Thermosonic (T/S) Gold Ball Wire Bonding and Ultrasonic (U/S) Aluminum Wedge Wire Bonding. Approximately 90% of all IC Assembly in Semiconductor Packages is manufactured using Gold Ball Bonding process, while Aluminum Wedge Bonding is used to produce about 10% of other Wire Bonding requirements on Printed Circuit Boards (PCB), Printed Circuit Flex (PCF) and other Packages.
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Golden State is a contract manufacturer that makes wire harnesses, electromechanical assemblies (box builds, subassemblies, PCBAs, kits, etc.) and services (sorting, rework, value additive manufacturing engineering)
18220 Butterfield Blvd
Morgan Hill, CA USA
Phone: 5102268155
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