Industry News | 2003-02-27 08:41:52.0
Elec & Eltek International Co. Ltd. (
Industry News | 2010-09-07 11:18:39.0
SMTA China announced the Best Paper/Presentation and Best Exhibit Awards at its annual awards presentation held in conjunction with the SMTA China 5th Anniversary Keynote Breakfast Reception, which took place September 1, 2010 at the Futian Shangri-la, Shenzhen Hotel.
Industry News | 2023-05-15 17:38:25.0
IPC and the International Microelectronics Assembly and Packaging Society (IMAPS) will host an "On-Shoring Advanced Packaging and Assembly," workshop July 10-12, 2023, in Washington, D.C.
Industry News | 2023-10-23 09:48:49.0
IPC, part of MAPT Roadmap Extended Executive Committee provides data on next generation advanced packaging, materials, substrates, and supply chain future needs
Industry News | 2013-01-28 07:29:00.0
IPC APEX EXPO® debut new products and services
Industry News | 2022-12-07 07:48:52.0
With synchronous motion, the SELECT Synchro system boosts throughput 20-40% for most applications in a 60% smaller footprint
Industry News | 2009-10-16 17:12:49.0
Penang, Malaysia – SMTA is proud to announce special events for the South East Asia Technical Conference on Electronics Assembly Technologies, to be held November 18-20, 2009 at the Equatorial Hotel in Penang, Malaysia.
Industry News | 2017-07-23 20:13:17.0
SMTA announces an expanded program for the final day of the SMTA International Conference, September 17 - 21, 2017 in Rosemont, Illinois. In addition to the Lead-Free Symposium, the technical committee expanded the Thursday program to four concurrent tracks. The three additional tracks will focus on Advanced Packaging Technology, Manufacturing Excellence, and Inspection Technologies.
Industry News | 2022-07-25 08:18:26.0
IPC is encouraging the U.S. Senate and House to complete action on slimmed-down R&D legislation, following a Senate vote clearing the way for a vote in the coming days.
Industry News | 2013-07-19 11:27:23.0
The SMTA and Chip Scale Review magazine are pleased to announce the presentation line-up for the 10th Annual International Wafer-Level Packaging Conference.
