Industry News: dek and camera (Page 15 of 29)

Manncorp's 6,400 CPH dual-head MC-392 pick-and-place features ball screw X-Y and 30um, 3 sigma accuracy

Industry News | 2010-12-01 13:36:54.0

Although all five models in Manncorp’s latest-generation MC series pick-and-place systems have received industry acclaim, one system in particular has stood out for its extraordinary price/performance ratio, according to CEO Henry Mann.

Manncorp

Viscom to premier new and ultra-fast budget AOI system S3088 QC at NEPCON South China 2013

Industry News | 2013-08-13 16:52:23.0

Viscom AG will showcase its latest innovations at NEPCON South China 2013, scheduled to take place August 27-29, 2013 at the Shenzhen Convention & Exhibition Center in China.

Viscom AG

Seika Machinery to demo dry cabinet, stencil cleaner, tabletop router and more at SMTAI

Industry News | 2021-10-07 15:17:02.0

Seika Machinery, Inc. is pleased to announce plans to exhibit at the SMTA International Exposition, scheduled to take place Nov. 3-4, 2021 at the Minneapolis Convention Center in Minneapolis, MN. Seika will highlight the following equipment in Booth #3506: McDry Storage Cabinets, Sawa Ecobrid Stencil Cleaner, Sayaka SAM-CT23S Table-Top PCB Router, Tsuchiyama n=1 Checker and MALCOM RCX Series Modular Reflow Oven Profiling System.

Seika Machinery, Inc.

Saki Demonstrates Range of 2D and 3D AOI Systems at NEPCON Korea, Booth X133

Industry News | 2016-04-07 16:45:47.0

Saki Corporation will demonstrate 2D and 3D automated optical inspection (AOI) systems at NEPCON Korea 2016, COEX, Seoul, Korea, from April 6-8 at booth X133. Technical experts will help assess the correct AOI solution for specific inspection and measurement needs.

SAKI America

Saki Demonstrates High Speed, High Resolution 2D and 3D AOI Systems at NEPCON China, Stand 1J25

Industry News | 2016-04-20 18:39:31.0

Saki Corporation will present its 2D and new 3rd generation 3D automated optical inspection (AOI) systems at NEPCON China 2016, held from April 26-28, at the Shanghai World Expo & Exhibition Center, in stand 1J25. Technical experts will be at the booth to discuss the factors to consider to determine the correct AOI system for specific inspection and measurement needs.

SAKI America

New Viscom 3D AOI line-up and 360View feature for improved 3D inspection

Industry News | 2016-07-26 18:48:27.0

Viscom today announced plans to introduce its new 3D AOI line-up to Asian markets, highlighting its new 360View feature in Stand 1F35 at NEPCON South China, scheduled to take place Aug. 30-Sept. 1, 2016 at the Shenzhen Convention & Exhibition Centre.

Viscom AG

Seika Machinery to demo leading equipment from McDry, Sawa, Sayaka MALCOM and more at APEX

Industry News | 2022-01-03 07:22:33.0

Seika Machinery, Inc. is pleased to announce plans to exhibit at the 2022 IPC APEX EXPO, scheduled to take place Jan. 25-27, 2022 at the San Diego Convention Center in California. Seika will highlight the following equipment in Booth #1914: McDry Storage Cabinets, Sawa Ecobrid Stencil Cleaner, Sayaka SAM-CT23S Table-Top PCB Router, Tsuchiyama n=1 Checker and MALCOM RCX Series Modular Reflow Oven Profiling System.

Seika Machinery, Inc.

MVP Expands the Application of the 900 and Versa Platforms at IPC APEX EXPO 2022

Industry News | 2022-01-19 12:07:24.0

Vista, CA – January 18, 2022. Machine Vision Products, Inc. (MVP) will be demonstrating its capability for inspection and metrology across a broad range of applications in SMT and MicroElectronics. This will be supported on its two core platforms, the 900 and Versa Series of AutoInspectors. The 900 platform is designed for microelectronics applications while the Versa is aligned to SMT and SPI inspection.

Machine Vision Products, Inc

PVA to Showcase Advanced Dispensing and Coating Technologies at The ASSEMBLY Show 2024

Industry News | 2024-09-23 20:20:27.0

PVA is excited to announce its participation in The ASSEMBLY Show, scheduled to take place October 22-24, 2024 at the Donald E. Stephens Convention Center in Rosemont, IL. PVA will be exhibiting in Booth 1706, where attendees can explore the latest advancements in conformal coating, dispensing robotics and manual systems.

Precision Valve & Automation (PVA)

ATE China 2010 Set to Reenergize Growth of Electronics Assembly and Packaging Industry

Industry News | 2010-08-10 14:16:50.0

The Electronics Assembly and Packaging Technology Expo 2010 (ATE China 2010) will take place between August 31 and September 2 at the Shenzhen Convention & Exhibition Center. The expo will highlight various types of electronics assembly and packaging facilities, both locally and abroad. It also will offer technical solutions to assembly and production problems and allow buyers to identify new suppliers ― all of which will enhance competitiveness in the industry.

Reed Exhibitions - RX (Reed Exhibitions)


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