Industry News | 2019-01-30 20:37:50.0
Metcal today announced the global launch of the first Robotic Soldering System with patented Connection Validation (CV) technology and a touchscreen graphical user interface to drastically mitigate the risk of solder joint defects and add productivity to the manufacturers’ soldering process.
Industry News | 2016-09-08 13:30:10.0
Engineered Material Systems is pleased to introduce the DF-3520 dry-film negative photo resist for use in micro-electro mechanical systems (MEMS), wafer-level packaging and CMOS applications (TSV sealing). This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.
Industry News | 2019-08-19 12:23:12.0
Viscom plans to exhibit at SMTA International and highlight the S3088 ultra chrome in Booth #315. The system is designed to meet the demand for high throughput production lines, inspect the most leading-edge electronics and be cost competitive.
Industry News | 2017-01-09 18:11:30.0
Engineered Material Systems is pleased to introduce the DF-3560 dry-film negative photoresist for use in micro-electro mechanical systems (MEMS), wafer-level packaging and CMOS applications (TSV sealing). This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.
Industry News | 2010-08-23 13:40:28.0
Toronto, Ontario Canada. PFC Flexible Circuits Limited announced today that it has expanded its assembly capacity and its capabilities.
Industry News | 2011-06-28 15:43:55.0
Speedprint, part of the Blakell Europlacer Group, has appointed FHP Reps to serve its customers in northern Texas, Oklahoma, Arkansas and Louisiana.
Industry News | 2011-07-13 15:37:46.0
Speedprint has appointed FHP Reps as its manufacturers’ representative for the North American states of Colorado, Utah and Wyoming.
Industry News | 2012-09-21 17:35:47.0
Speedprint Technology will exhibit at the upcoming Long Island SMTA Expo and Technical Forum
Industry News | 2019-01-15 19:43:33.0
Engineered Material Systems is pleased to debut its TM-6520 low temperature cure adhesive. Designed for die attach and general circuit assembly applications, the adhesive is electrically insulating and offers high thermal conductivity.
Industry News | 2014-03-26 08:17:39.0
Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), announces that it has been awarded a 2014 NPI (New Product Introduction) Award in the category of Test and Inspection – Functional Test for its Camera Assist Automatic Bondtesting.