Industry News | 2003-03-06 08:10:20.0
Astec Power has expanded its popular APC-Centauri surface-mount product line to include a series of 40W point-of-load DC/DC convertors.
Industry News | 2003-03-11 08:45:00.0
CAMtastic DXP is the latest version of Altium's complete CAM verification and editing system that bridges the gap between PCB design and manufacturing and facilitates communication between board designers, fabrication engineers, and their clients.
Industry News | 2023-10-16 12:50:01.0
MIRTEC announces the release of their All-New ART Hybrid 3D AOI System at Productronica 2023. The World's leading trade fair for the electronics manufacturing industry will take place Nov. 14-17, 2023, at the Trade Fair Center Messe München, Germany. All are welcome to MIRTEC's Booth #461 in Hall A2 for a detailed demonstration of what will undoubtedly be recognized as the World's Most Technologically Advanced 3D AOI System!
Industry News | 2017-05-19 13:34:13.0
Precision PCB Services is pleased to announce the addition of a Nitrogen capable BGA Rework Station to their product line.
Industry News | 2009-11-29 22:25:49.0
Showcasing the latest expansion of its global stencil network, DEK and new franchisee, Huntsville, Alabama-based AGI Corporation, opened the doors of their manufacturing operation to local customers on October 21, 2009. Attended by both leading EMS and OEM electronics firms as well as Huntsville’s Mayor, Mr. Tommy Battle, the DEK-AGI Open House was a technology-rich event designed to highlight the company’s stencil production expertise.
Industry News | 2010-06-21 16:04:54.0
Demonstrating its extensive knowledge base for today’s demanding back-end wafer level processes, DEK’s presence at the upcoming Semicon West event in San Francisco, California will feature the Galaxy print platform with Wafer Transport Solution. This system, displayed alongside the CHAD WaferMate 300-1, is configured with a precision wafer pallet and high-performance transport rails, ensuring the accuracy and stability required for DEK’s established and emerging cost-effective Wafer Level Packaging (WLP) applications.
Industry News | 2008-06-26 14:36:27.0
Building on its decades of materials deposition expertise, DEK has developed several unique advanced technology systems to enable next-generation semiconductor packaging and solar cell production processes. At the upcoming Semicon West event, scheduled for July 15 � 17 at San Francisco�s Moscone Center, DEK will display some of these latest innovations along with its new VectorGuard� Platinum stencil technology.
Industry News | 2009-06-23 20:26:31.0
Debuting its most recent technology advance, mass imaging leader DEK will showcase the company’s new thin wafer processing expertise from booth #811 at the upcoming Semicon West event in San Francisco, California. A full line solution that incorporates a Galaxy Thin Wafer System and a next-generation CHAD WaferMate™ wafer handler, this latest development resolves traditional challenges associated with high-speed handling and processing of thinned wafers on a proven print platform.
Industry News | 2009-03-19 15:22:08.0
Mass Imaging leader and screen printing technology pioneer, DEK, is inviting all APEX attendees to discover how to get even more out of their print process and yield better products while lowering overall costs.
Industry News | 2009-04-21 12:38:53.0
Since DEK introduced its ProFlow� enclosed print head system over a decade ago, it has been recognized industry-wide for its ability to advance materials deposition applications around the world. Today, DEK has extended the capabilities and process window of its pioneering technology even further with the launch of its highly anticipated ProFlow Evolution.
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