Industry News | 2013-02-20 18:54:10.0
IPC — Association Connecting Electronics Industries® presented Committee Leadership, Distinguished Committee Service and Special Recognition Awards at IPC APEX EXPO® at the San Diego Convention Center.
Industry News | 2009-09-26 16:32:37.0
DEK has launched its brand new Paste Roll Height Monitor, an easy-to-use productivity tool designed to eliminate defects and improve end-of-line yield. Using lasers to detect the presence of solder paste, the new technology monitors the height of the paste roll to provide operators with a new level of process control.
Industry News | 2009-08-19 13:06:06.0
Extending its capabilities for placing solder spheres at high speed, DEK’s proven DirEKt Ball Placement™ process now enables accurate solder sphere deposition for spheres as small as 200µm in diameter with pitches as tight as 300µm. With the ability to achieve this accuracy and precision at a first pass yield of over 99.99%, DirEKt Ball Placement delivers the speeds necessary for modern package manufacture without sacrificing anything in the way of performance.
Industry News | 2003-06-13 10:10:58.0
By combining PacTech's electroless under bump metallization (UBM) processing with DEK's advanced mass imaging systems to create the solder bumps, users can implement a wafer-level, SMT-compatible flip chip assembly process.
Industry News | 2012-03-24 10:06:28.0
NEPCON China Becomes a Platform for the Debut of New Product Releases in Asia
Industry News | 2016-03-07 14:06:37.0
Market Leader AdoptSMT will showcase at SMT 2016 in Hall 7, Stand No. 7-100 an array of new innovative products. These products and the service AdoptSMT offers their customers make AdoptSMT’s slogan become true: We keep your production running. AdoptSMT covers the processes of PCB assembly, hand soldering and industrial identification.
Industry News | 2016-04-01 23:53:56.0
Ahead of SMT Hybrid Packaging 2016 (26 to 28 April 2016), Erhard Hofmann, MD AdoptSMT explains what the company is showcasing in Nuremberg.
Industry News | 2008-10-01 23:36:35.0
Two of Indium Corporation's technology experts will be participating in the International Wafer-Level Packaging Conference (IWLPC), October 13-16, 2008 in San Jose, CA: Semiconductor Packaging Materials Product Manager, Andy C. Mackie, Ph.D. and Applications Engineer Jim Hisert.
Industry News | 2013-11-04 14:24:00.0
When the 20th productronica opens its gates in Munich in a few days, it will feature a multifaceted supporting program. The CEO Roundtable will allow leading executives from the commercial and scientific sectors to discuss the topic "Industry 4.0 - Opportunities and Challenges for a Competitive Production of Tomorrow". Among other things, the event will focus on the international exchange of ideas and information within the electronics production sector.
Industry News | 2010-04-14 20:35:47.0
Professional exhibition is generally the barometer of industry development. As one of the largest professional exhibitions of the Chinese electronics manufacturing and surface mount industry, NEPCON China undoubtedly reflects the reality of the electronics manufacturing industry climate in China. The continuous downturn of the global economy since 2008 frustrates many vendors in the industry in respect to the future of the market. In 2009, the economy in China grew successfully by more than 8 percent. In 2010, China will make further adjustments to industrial structure while keeping sustainable economic growth. Based on this, what is the future of the electronics manufacturing industry? Visitors will obtain personal experience at NEPCON China 2010, which will be held on April 20, 2010 in Shanghai.
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Industrial Sensor Vision International specializes in advanced camera technology of high resolution fast speed cameras for automation, AOI, 2-D/3-D, SPI inspection and wafer inspection.
3 Morse Road 2A
Oxford, CT USA
Phone: +1 203 592 8723
