Industry News: dek flash disk (Page 1 of 3)

Samsung Files Patent Infringement Suit Against SanDisk

Industry News | 2002-03-12 07:20:11.0

Samsung Electronics has filed a patent infringement lawsuit against SanDisk Corp. over several patents related to flash data storage.

Samsung Electronics

Aspiring to higher yields and less rework? DEK’s Consumables are Process Improvement Products

Industry News | 2009-07-02 17:51:04.0

Recognising that too many print processes are compromised by poor quality Consumables, DEK’s Process Improvement Products are designed to boost productivity and yield, reduce the risk of defects and minimise rework.

ASM Assembly Systems (DEK)

Aspiring to higher yields and less rework? DEK’s Consumables are Process Improvement Products

Industry News | 2009-07-07 13:32:54.0

Recognising that too many print processes are compromised by poor quality Consumables, DEK’s Process Improvement Products are designed to boost productivity and yield, reduce the risk of defects and minimise rework.

ASM Assembly Systems (DEK)

Parvus to Offer CompactFlash IDE Adapter for Embedded Computers, Supporting Both Type I and Type II Cards with 40 or 44-Pin IDE Connections

Industry News | 2004-08-16 11:54:31.0

Low-cost CFII-IDE adapter provides panel-mountable solution for solid-state CompactFlash and IBM� Microdrive� media

Parvus Corporation

Innodisk Gives Sneak Peek of New Industrial Flash Products at Embedded World 2015

Industry News | 2015-02-06 02:51:52.0

New eMMC card, SATA Express and PCIe products as well as vertical market solutions will be displayed and demoed at annual embedded system trade fair

Innodisk Corporation

New Yorker Electronics Delivers Advanced New 96-Layer 3D NAND Flash Storage from Innodisk

Industry News | 2021-01-05 10:57:10.0

The Innodisk 3TE7 and 3TG6-P Utilize Industrial-Grade 3D TLC NAND from Toshiba with a 3000 P/E Cycle Number for Increased Endurance

New Yorker Electronics

COM-1440 PC/104-Plus 4-Port USB 2.0 Controller from Parvus Now Available with Support for uDiskonChip SSD

Industry News | 2005-09-12 15:55:00.0

Parvus Announces Availability of COM-1440 Module, USB 2.0 Host Controller Card with High Current Drive Capable of Powering USB Mass Storage Devices

Parvus Corporation

Data I/O’s FlashCORE III Wins a 2009 Global Technology Award

Industry News | 2009-11-11 12:15:12.0

REDMOND, Wash. – November 2009 – Data I/O Corporation (NASDAQ: DAIO), the leading provider of manual and automated device programming solutions, announces that it has been awarded a Global Technology Award in the category of Programming for its FlashCORE III. The award was presented to the company during a Tuesday, November 10, 2009 ceremony that took place at the New Munich Trade Fair Center in Munich, Germany.

Data I/O Corporation

Engineered Material Systems Releases Die Attach for Light Emitting Diodes and Small Power Semiconductor Devices

Industry News | 2012-02-15 19:12:30.0

Engineered Material Systems has released its new DA-5045-2 and DA-5045-4 High Thermal Conductivity Die Attach Adhesives for attaching light emitting diodes (LEDs) and small die.

Engineered Materials Systems, Inc.

Data I/O FlashCORE III Programming Technology to Debut at Productronica

Industry News | 2009-12-07 18:08:56.0

Data I/O Corporation (NASDAQ: DAIO), the provider of manual and automated device programming solutions, today announced plans to debut its new FlashCORE III programming architecture at Productronica in Hall A2, Stand 329. This new technology will be at the core of every product to be highlighted at this key industry event, scheduled to take place 10th – 13th November at the Munich Trade Fair Center in Munich, Germany.

Data I/O Corporation

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