Industry News: dek proflow (Page 1 of 2)

Innovative Technology Center at IPC APEX EXPO Highlights Leading Edge Technologies.

Industry News | 2010-03-27 19:26:29.0

BANNOCKBURN, Ill., USA, - IPC - Association Connecting Electronics Industries® announces the products that will be featured in the Innovative Technology Center (ITC) at IPC APEX EXPO™, April 6–8, 2010, in Las Vegas. Assessed by an IPC Review Board of industry experts, the products were selected based on their representation of a new or emerging technology of significant value and relevance to the electronics manufacturing industry.

Association Connecting Electronics Industries (IPC)

DEK ProFlow ATx Tops Performance and Cost-Efficiency among Enclosed Head Print Systems

Industry News | 2010-04-22 16:26:45.0

DEK's ProFlow® system is arguably the gold-standard for enclosed head printing technology. With nearly a decade of documented process advance under its belt, ProFlow has now evolved to deliver even greater electronics assembly performance, ease-of-use and environmental responsibility with ProFlow ATx.

ASM Assembly Systems (DEK)

Award-Winning ProFlow� Technology from DEK Evolves to Broaden Capability and Expand Process Window

Industry News | 2008-03-20 21:02:07.0

Since it�s introduction to the electronics industry over ten years ago, DEK�s ProFlow� enclosed head printing system has won numerous awards and effectively enabled many advances in materials deposition applications around the globe. Now, as ProFlow moves into its second decade, the technology has been further developed to deliver an expanded process window and even broader capabilities.

ASM Assembly Systems (DEK)

DEK presents ProFlow� Evolution; extends award-winning technology's capability & process window

Industry News | 2009-04-21 12:38:53.0

Since DEK introduced its ProFlow� enclosed print head system over a decade ago, it has been recognized industry-wide for its ability to advance materials deposition applications around the world. Today, DEK has extended the capabilities and process window of its pioneering technology even further with the launch of its highly anticipated ProFlow Evolution.

ASM Assembly Systems (DEK)

DEK’s ProFlow® ATx system meets real-world mass production & product complexity challenges

Industry News | 2010-04-28 21:43:42.0

Following a successful evaluation period, DEK’s ProFlow® ATx enclosed print head technology has been adopted by a high profile electronics company due to its ability to meet complex mass production requirements. As specialists in design, production and product management, the electronics solutions company had strict evaluation criteria that the DEK system successfully met and even, in some cases, exceeded.

ASM Assembly Systems (DEK)

DEK�s ProFlow� DirEKt Imaging technology wins prestigious industry manufacturing award

Industry News | 2006-04-17 18:17:31.0

DEK has won another prestigious industry award for its revolutionary ProFlow� DirEKt Imaging technology. At the Nepcon China 2006 exhibition in Shanghai, China, DEK will receive the award for best entry in the Dispensing Systems/Equipment category at the Electronics Manufacturing Asia Innovation Awards 2006.

ASM Assembly Systems (DEK)

Process Fills Vias Faster than Squeegees

Industry News | 2003-03-11 09:04:04.0

Developed in response to customer requirements, the new Via Fill process from DEK delivers 100% fill of substrate vias with no voids and minimal surface residue.

ASM Assembly Systems (DEK)

Expect More from DEK at NEPCON Shanghai 2008 - Hall W1, Booth 1B30

Industry News | 2008-03-24 22:29:31.0

The DEK team is planning to celebrate the mass imaging leader�s 40th anniversary in style at this year�s Nepcon China, bringing a wide variety of pioneering print platforms and Productivity Tools to the Shanghai Everbright Convention & Exhibition Centre over April 8-11. Visitors can meet the DEK team on booth 1B30 where the company will be demonstrating its expert knowhow in action.

ASM Assembly Systems (DEK)

Extreme Productivity; DEK Unveils Untouchable Print Performance at APEX 2010

Industry News | 2010-03-17 18:13:49.0

From the recently enhanced Horizon platform to complete print process control tools to next-generation stencil technologies, the DEK display at APEX 2010 will treat booth visitors to the ultimate in print productivity.

ASM Assembly Systems (DEK)

DEK and PacTech Join Forces for High-Volume Wafer Bumping Solution

Industry News | 2003-06-13 10:10:58.0

By combining PacTech's electroless under bump metallization (UBM) processing with DEK's advanced mass imaging systems to create the solder bumps, users can implement a wafer-level, SMT-compatible flip chip assembly process.

ASM Assembly Systems (DEK)

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