Industry News | 2018-03-14 18:46:31.0
IPC – Association Connecting Electronics Industries® presented Committee Leadership, Distinguished Committee Service and Special Recognition Awards at IPC APEX EXPO 2018 at the San Diego Convention Center. The awards were presented to individuals who made significant contributions to IPC and the industry by lending their time and expertise through IPC committee service.
Industry News | 2002-05-14 09:08:43.0
SMEMA Compliant Solution to be Developed for Wafer Bumping Screen Printers
Industry News | 2012-02-15 21:13:52.0
In a significant technology breakthrough set to upend former industry perceptions of closed loop printing processes, DEK announces the development and commercial launch of its revolutionary new closed loop innovation, ProDEK.
Industry News | 2012-02-15 03:10:09.0
In a significant technology breakthrough set to upend former industry perceptions of closed loop printing processes, DEK announces the development and commercial launch of its revolutionary new closed loop innovation, ProDEK.
Industry News | 2011-12-02 21:39:53.0
Over the past month, DEK and its Mexican-based representative, Interlatin, have embarked on a Productivity Solutions Tour that has so far hosted four events in three cities and attracted nearly 150 customers. Setting up shop in Guadalajara, Monterrey, Tijuana and early next month in Ciudad Juarez, Mexico, the technology-rich Productivity Solutions Tour program is effectively enabling assembly specialists to get even more out of their print processes.
Industry News | 2010-06-21 16:04:54.0
Demonstrating its extensive knowledge base for today’s demanding back-end wafer level processes, DEK’s presence at the upcoming Semicon West event in San Francisco, California will feature the Galaxy print platform with Wafer Transport Solution. This system, displayed alongside the CHAD WaferMate 300-1, is configured with a precision wafer pallet and high-performance transport rails, ensuring the accuracy and stability required for DEK’s established and emerging cost-effective Wafer Level Packaging (WLP) applications.
Industry News | 2008-10-01 23:36:35.0
Two of Indium Corporation's technology experts will be participating in the International Wafer-Level Packaging Conference (IWLPC), October 13-16, 2008 in San Jose, CA: Semiconductor Packaging Materials Product Manager, Andy C. Mackie, Ph.D. and Applications Engineer Jim Hisert.
Industry News | 2008-06-26 14:36:27.0
Building on its decades of materials deposition expertise, DEK has developed several unique advanced technology systems to enable next-generation semiconductor packaging and solar cell production processes. At the upcoming Semicon West event, scheduled for July 15 � 17 at San Francisco�s Moscone Center, DEK will display some of these latest innovations along with its new VectorGuard� Platinum stencil technology.
Industry News | 2009-06-23 20:26:31.0
Debuting its most recent technology advance, mass imaging leader DEK will showcase the company’s new thin wafer processing expertise from booth #811 at the upcoming Semicon West event in San Francisco, California. A full line solution that incorporates a Galaxy Thin Wafer System and a next-generation CHAD WaferMate™ wafer handler, this latest development resolves traditional challenges associated with high-speed handling and processing of thinned wafers on a proven print platform.
Industry News | 2006-11-02 16:12:29.0
SAN JOSE, Calif.
