Industry News: delamination bare board (Page 1 of 42)

Circuits West Invests in AOT

Industry News | 2003-03-28 08:46:12.0

The high scan speeds and fast setup times of the Excalibur system make it a good choice for this sector of the bare-board PCB manufacturing industry

SMTnet

Introbotics Announces New Board Testing Capability for Merix Corporation

Industry News | 2003-04-01 08:13:08.0

The Introbotics equipment boosts controlled impedance testing productivity and accuracy by a factor of ten compared to the handheld probing techniques.

SMTnet

IPC Delivers New Standard on Handling, Packaging and Storage of Printed Boards

Industry News | 2010-09-13 15:36:15.0

IPC — Association Connecting Electronics Industries® has released IPC-1601, Printed Board Handling and Storage Guidelines. The industry's sole standard on the handling, packaging and storage of printed boards, IPC-1601 provides users with guidance on how to protect printed boards from contamination, physical damage, solderability degradation, electrostatic discharge and moisture uptake.

Association Connecting Electronics Industries (IPC)

Demystifying PCB Board Router Milling Bits

Industry News | 2023-10-31 03:45:24.0

In the realm of PCB manufacturing, precision and efficiency are pivotal. The tools and equipment used in the process are instrumental in achieving these goals. A key player in this process is the PCB board router milling bit. In this guide, we'll explore the types of PCB board router milling bits, their dimensions, and the importance of rotation direction in specific PCB cutting machines.

I.C.T ( Dongguan Intercontinental Technology Co., Ltd. )

IPC and DPC Collaborate on Web Seminar

Industry News | 2003-04-29 07:30:06.0

Announce their plans to co-sponsor a free online conference on the current state of bare die packaging

Association Connecting Electronics Industries (IPC)

What is the working principle of I.C.T Lyra Reflow Oven

Industry News | 2022-11-11 07:33:41.0

Lyra Reflow Oven is a soft soldering that realizes the mechanical and electrical connection between the solder ends of surface mount components or the pins and the printed board pads by remelting the solder paste pre-distributed on the printed board pads.

Dongguan Intercontinental Technology Co., Ltd.

Poll Finds Solder Finish, BGA Components and Reflow Soldering Most Challenging for Industry Engineers

Industry News | 2012-01-22 23:16:58.0

More than 350 engineers who attended last week’s IPC webinar, Soldering and Assembly Defects, were polled on their biggest headaches with printed boards, PCB components and PCB assembly process failures. The survey results which identify solder finish, ball grid array (BGA) components and reflow soldering as the greatest challenges, provide webinar co-sponsor, National Physical Laboratory (NPL) of the United Kingdom with useful information as it prepares its NPL Process Defect Clinic for IPC APEX EXPO® 2012.

Association Connecting Electronics Industries (IPC)

Industry's Most Baffling Defects No Match For Free Process Defect Clinic At IPC Apex Expo 2012

Industry News | 2011-12-02 18:36:19.0

Manufacturing and quality engineers looking for solutions to process challenges will find answers at the NPL Process Defect Database Clinic at IPC APEX EXPO®, February 28-March 1, 2012, at the San Diego Convention Center. Organized by IPC and the National Physical Laboratory (NPL), the free clinic will be held in the exhibit hall to assist event attendees with assembly and soldering process problems, RoHS compliance issues, solderability concerns, field failures and other process-related issues.

Association Connecting Electronics Industries (IPC)

IPC APEX EXPO Tackles Buzz-worthy Industry Issues in Free Sessions

Industry News | 2011-11-03 22:26:02.0

They are the subjects of countless headlines and industry tweets - the impact on industry of conflict minerals, embedded technology, process defects and supply line issues such as counterfeit parts - and the topics of two full days’ worth of free BUZZ sessions at IPC APEX EXPO® 2012.

Association Connecting Electronics Industries (IPC)

Updates to IPC-6012 and IPC-A-600 Released: Five Years of New Board Technologies and Processes Bring Significant Changes to Specifications.

Industry News | 2010-04-10 02:09:54.0

If a picture is worth a thousand words, the new H revision of IPC-A-600, Acceptability of Printed Boards, is a priceless work of art for fabricators and assemblers, particularly inspectors and product developers. IPC — Association Connecting Electronics Industries® announces the new releases of IPC-A-600H and its companion document the C revision of IPC-6012, Qualification and Performance Specification for Rigid Printed Boards.

Association Connecting Electronics Industries (IPC)

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