Industry News | 2013-10-08 16:16:49.0
Storagesolutions, a leading provider of automatic storage systems for the electronics industry and division of ESSEGI SYSTEM SERVICE s.r.l., will exhibit in Hall A3, Stand #201 at the Productronica International Trade Fair, scheduled to take place November 12 - 15, 2013 at the New Munich Trade Fair Centre in Munich, Germany.
Industry News | 2013-07-16 10:52:26.0
Etek Europe Ltd is proud to announce that it has achieved the Investors in People Accreditation, the most successful framework for business improvement through people in the UK.
Industry News | 2014-06-10 11:59:03.0
(Albany, NY) June 10, 2014. YINCAE Advanced Materials, LLC is pleased to announce the availability of a series of new encapsulant products that enable greater production temperature flexibility for microchips with different alloy applications.
Industry News | 2015-12-01 10:29:53.0
KIC today announced that it will showcase the affordable and easy-to-use ProBot automatic profiling system at the SMTA Rocky Mountain (Denver) Expo & Tech Forum, scheduled to take place Tuesday, Jan. 26, 2016 at the Mile High Stadium in Denver, CO. The ProBot automatically measures the profile for each PCB and verifies whether each PCB is processed to specification in the reflow oven.
Industry News | 2018-05-18 15:47:55.0
As chips and packages become more complex, and installed in harsher conditions such as automobiles, the thermal conductivity of underfill materials becomes a greater concern. What can be done to prevent decreased reliability due to thermal dissipation issues?
Industry News | 2021-01-21 09:42:44.0
YINCAE is excited to announce that we have developed SMT 158D8 a high thermal conductive underfill that is capillary and fast-flowing, and an easy reworkable liquid epoxy.
Industry News | 2021-02-24 11:47:14.0
YINCAE is excited to announce that we have developed SMT 158N series, including a non-flow, low temperature slow cure and high purity liquid epoxy underfill and capillary underfill encapsulant.
Industry News | 2022-03-30 14:59:52.0
YINCAE is excited to announce that we have developed DA158N die attach materials which is thermal conductive and electrical insulating adhesives. It can be fast cured at low temperature. The development of DA 158N is preparing the materials for people to live in the Mars.
Industry News | 2023-03-27 14:51:47.0
We are thrilled to announce that YINCAE has some exciting news to share with you! We have recently introduced a breakthrough technology - thermal underfill UF 158A2 which can dramatically shorten the manufacturing process and improve the heat dissipation.
Industry News | 2008-05-15 23:05:35.0
RICHARDSON, Texas (May 14, 2008) - Responding to the increasing momentum in the electronics industry toward embedded instrumentation, ASSETR InterTech, Inc. (www.asset-intertech.com) announced it is positioning the company, its products and its technologies to provide open tools for embedded instrumentation in design validation, test and debug applications.
