Industry News: detecting cracked mlcc (Page 1 of 4)

Time Temperature setting wave soldering is the most important in the solder melts

Industry News | 2018-10-18 09:27:40.0

Time Temperature setting wave soldering is the most important in the solder melts

Flason Electronic Co.,limited

VOLUNTEERS HONORED FOR CONTRIBUTIONS TO ELECTRONICS INDUSTRY AND IPC More than 150 awards presented at IPC APEX EXPO 2014

Industry News | 2014-03-28 09:54:48.0

IPC – Association Connecting Electronics Industries® presented Committee Leadership, Distinguished Committee Service and Special Recognition Awards at IPC APEX EXPO® at Mandalay Bay Convention Center in Las Vegas.

Association Connecting Electronics Industries (IPC)

The System of X-ray Radiography Non-destructive Testing technology

Industry News | 2021-11-30 01:54:12.0

After more than 100 years of development, X-ray imaging technology has formed a relatively complete X-ray non-destructive testing (NDT) technology system. In order to meet these needs, new detection technologies are constantly innovating, using Xray inline inspection technology. It can not only detect invisible crack or porosity such as aluminum casting , but also qualitatively and quantitatively analyze the detection results to find flaws early.

Unicomp Technology Co., Ltd

OK International launches enhanced PV tabbing and bussing soldering systems

Industry News | 2010-03-03 14:29:02.0

OK International (www.okinternational.com) has launched a new soldering system for PV tabbing and bussing applications proven to reduce micro cracking. The PS900 with specially designed hoof tip geometry optimizes the power delivered to the solder joint while it’s temperature-sensitive heater ensures low temperature soldering thus minimizing thermally induced stresses on cell surfaces.

OK International

Viscom to Showcase Advanced SPI, X-ray and 3D AOI Portfolio at SMTAI

Industry News | 2014-08-26 16:50:47.0

Viscom announced today that it will exhibit in Booth #434 at SMTA International, scheduled to take place Sep. 30 - Oct. 1, 2014 at the Donald Stephens Convention Center in Rosemont, IL.

Viscom AG

High-Precision Conformal Coating Inspection with a Standard Transport Clearance of 105 mm

Industry News | 2020-11-24 15:18:53.0

Viscom's proven S3088 CCI inspection system ensures high-precision conformal coating inspection of printed circuit boards. The system quickly and reliably detects typical defects such as cracks, coating voids, smearing and splashing. Layer thickness and wet coating can also be analyzed. The S3088 CCI now comes standard with an unmatched upper transport clearance of 105 mm, thus providing even more flexibility during final inspection of fully assembled components.

Viscom AG

Inovar Expands Capabilities with New X-Ray Fluorescence System

Industry News | 2008-12-26 20:30:25.0

LOGAN, UTAH � Inovar, an inthinc company and a leading contract electronics manufacturer (CEM) dedicated to providing flexible solutions to OEMs in the fastest growing segments of the electronic industry, announces that it has expanded its capabilities with the acquisition of a new Fischer Technologies FISCHERSCOPE X-RAY XDAL.

Inovar, Inc.

Orchid Technologies Designs Solar Power System

Industry News | 2009-09-18 13:59:46.0

Orchid Technologies’ custom high capacity energy storage designs are proven safe and tough.

Orchid Technologies Engineering & Consulting, Inc.

Vision Engineering’s FREE Electronics Academy Webinar Series to Broadcast: Eliminate Printed Circuit Board Problems and Failure Modes

Industry News | 2018-01-16 11:59:10.0

Vision Engineering has teamed up with industry-expert Bob Willis to broadcast a free Electronics Academy Webinar aimed at identifying the issues affecting PCB/SMT assembly and the challenges of achieving Zero Defect Manufacture. The next webinar, Eliminate Printed Circuit Board Problems & Failure Modes will take place on January 23rd at 2:30 EST.

Vision Engineering Inc.

Scanning Acoustic Microscopy Analyzes 3D Packages in the Z-dimension

Industry News | 2019-05-31 08:50:57.0

Non-destructive testing of 3D packages with scanning acoustic microscopes identifies defects down to sub-micron level for 100% inspection, failure analysis

PVA TePla America

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