Industry News: determination shelf life (Page 1 of 22)

Tin Whisker Joint Meeting Held in Tokyo

Industry News | 2003-06-23 08:49:39.0

Three Organizations from the US, Europe and Japan to

SMTnet

IPC Releases New IPC/PERM-2901, Pb-free Design and Assembly Implementation Guide IPC-PERM-2901 addresses the impact of Pb-free on reliability and service life for aerospace, defense and high-performa

Industry News | 2018-02-19 13:55:53.0

IPC — Association Connecting Electronics Industries® Pb-free Electronics Risk Management (PERM) Council has developed the first single document dedicated solely to assisting design engineering in the development of electronics that are completely lead-free (Pb-free) and meet the demanding requirements of aerospace, defense and high performance (ADHP) products and systems.

Association Connecting Electronics Industries (IPC)

Different Techniques for Plating

Industry News | 2018-10-18 11:08:03.0

Different Techniques for Plating

Flason Electronic Co.,limited

Solder Tinned Pads vs Gold Plated Pads - The Importance of Selecting the Proper Surface Finish

Industry News | 2018-10-18 10:16:53.0

Solder Tinned Pads vs Gold Plated Pads - The Importance of Selecting the Proper Surface Finish

Flason Electronic Co.,limited

Non-IC Electronic Components Covered in Latest Update of JEDEC and IPC Quality and Reliability Standard for SMDs

Industry News | 2012-02-07 00:45:44.0

IPC and JEDEC have released the C revision of IPC/JEDEC J-STD-033, Handling, Packing, Shipping and Use of Moisture/Reflow and/or Process Sensitive Components. With an expanded scope, the document now covers the handling, packing and shipping of non-IC electronic components that have been classified per EIA/IPC/JEDEC J-STD-075, Classification of Non-IC Electronic Components for Assembly Processes.

Association Connecting Electronics Industries (IPC)

SMTA Capital Chapter to Host Second Meeting of the Year on May 28th at NTS Baltimore on “Failure Analysis Process for Printed Board Assemblies” by John M. Radman

Industry News | 2015-05-18 21:29:50.0

The SMTA Capital Chapter is pleased to announce its second meeting of 2015 on May 28th, scheduled from 5:30 pm to 8:00 pm at NTS Baltimore formerly Trace Labs, 5 North Park Drive, Hunt Valley, MD 21030. The focus of this chapter meeting will be “Failure Analysis Process for Printed Board Assemblies” presented by John M. Radman, Senior Applications Engineer, NTS Baltimore.

Surface Mount Technology Association (SMTA)

Session 5 to Focus on Adhesives/Coatings at SMTA Harsh Environments Conference

Industry News | 2018-04-16 20:18:35.0

SMTA Europe announces Session 5 Technical Program on Adhesives and Coatings at the “Electronics in Harsh Environments Conference” to be held in Amsterdam, Netherlands, on April 25th, 2018.

Surface Mount Technology Association (SMTA)

Mars Curiosity Mission to be Featured at IPC APEX EXPO 2013 Chief Engineer B. Gentry Lee Slated for Thursday Keynote

Industry News | 2012-10-10 17:38:21.0

B. Gentry Lee, chief engineer for the Solar System Exploration Directorate at the Jet Propulsion Laboratory (JPL), will provide an inside look at the Mars Curiosity rover mission during his keynote address at IPC APEX EXPO®

Association Connecting Electronics Industries (IPC)

Electronics Reliability And Sustainability Focus of IPC Technical Conference

Industry News | 2010-08-04 21:04:22.0

Manufacturing reliable and sustainable electronics that meet customer needs without failure during the product’s life cycle has been stymied by myriad challenges, from environmental regulations to new materials and processes. Bringing together the latest research by industry experts, IPC — Association Connecting Electronics Industries® will host a Technical Conference on Electronics Sustainability, September 28–30 at Electronics Midwest, in Rosemont, Ill. Electronics Midwest is produced jointly by IPC and Canon Communications.

Association Connecting Electronics Industries (IPC)

SMT solder joint quality and appearance inspection process

Industry News | 2018-10-18 08:00:40.0

SMT solder joint quality and appearance inspection process

Flason Electronic Co.,limited

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