Industry News: dewetting on silver finish (Page 1 of 1)

The SMTA Capital Chapter to Host First Meeting of the Year on March 17th at EIT

Industry News | 2015-02-04 18:05:58.0

he SMTA Capital Chapter is pleased to announce its first meeting of 2015 on March 17th, scheduled from 5:30 pm to 8:00 pm at EIT (Main Building Lunchroom), 108 Carpenter Drive, Sterling, VA 20164. The focus of this chapter meeting will be “Elimination of Pb-Free Risk by Robotic Hot Solder Dip (RHSD)” presented by Donald Tyler, Managing Director, Corfin Industries.

Surface Mount Technology Association (SMTA)

IPC Conference on Electronics Assembly in Budapest Offers Critical Information for Eastern Europe’s Fast-Growing Industry

Industry News | 2012-01-07 21:33:05.0

To support the consistent and rapid growth in Eastern Europe’s electronics assembly industry, IPC will hold its second annual IPC Conference on Electronics Assembly: Soldering, Assembly & Inspection in Budapest, Hungary, on 20-22 March 2012. This three-day event includes workshops, a two-day technical conference and a tabletop exhibition, providing myriad opportunities for participants to network with industry experts and gain insight into new technologies and trends in this key market.

Association Connecting Electronics Industries (IPC)

IPC Electronics Assembly Conference in Budapest Offers Critical Information on Quality and Reliability

Industry News | 2010-08-31 12:11:44.0

Eastern Europe's growing electronics assembly industry faces new challenges, especially with the adoption of lead-free technology. To connect manufacturers with solutions to these challenges, IPC — Association Connecting Electronics Industries® is holding the IPC Electronics Assembly Quality & Reliability Conference in Budapest, Hungary on 6­–7 October, 2010.

Association Connecting Electronics Industries (IPC)

IPC Conference on Reliability Highlights New Findings in All Areas of Electronics Assembly

Industry News | 2011-08-24 17:13:21.0

The IPC Conference on Reliability: Assembly Process for a Reliable Product will be held November 1-2, 2011, in Irvine, Calif. The conference will address reliability issues that arise at the assembly level, dedicating half-day programs on new developments in each of three key areas: materials, processes, and test and inspection.

Association Connecting Electronics Industries (IPC)

IPC Delivers New Standard on Handling, Packaging and Storage of Printed Boards

Industry News | 2010-09-13 15:36:15.0

IPC — Association Connecting Electronics Industries® has released IPC-1601, Printed Board Handling and Storage Guidelines. The industry's sole standard on the handling, packaging and storage of printed boards, IPC-1601 provides users with guidance on how to protect printed boards from contamination, physical damage, solderability degradation, electrostatic discharge and moisture uptake.

Association Connecting Electronics Industries (IPC)

KOKI to Host Technical Webinar on Dewetting Defects in SMT Soldering

Industry News | 2025-11-17 12:22:01.0

KOKI, a global leader in advanced soldering materials and process solutions, today announced its upcoming technical webinar, "Understanding and Preventing Dewetting Defects in SMT Soldering."

Koki Company LTD

MICRONOX MX2123 to Lead KYZEN Offerings at The International Symposium on Microelectronics

Industry News | 2024-09-09 17:52:36.0

KYZEN will exhibit at The 2024 International Symposium on Microelectronics scheduled to take place October 1-3, 2024 at the Encore Boston Harbor. The KYZEN clean team will showcase multi-process power module cleaner MICRONOX MX2123 during the event.

KYZEN Corporation

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