Industry News: dewetting solder bump (Page 1 of 19)

Heller Industries Announces Joint Development Agreement with IBM for Fluxless Mass Reflow Soldering Process for High Volume Manufacturing

Industry News | 2013-08-15 20:58:22.0

Heller Industries announced today that they have entered into a joint development agreement with International Business Machines Corporation (NYSE: IBM), to collaborate on the development of fluxless mass reflow furnace equipment and process for high volume manufacturing. The fluxless process utilizes gas phase formic acid to replace standard fluxing agents, and eliminates the need for pre-reflow fluxing and post-reflow flux cleanup steps.

Heller Industries Inc.

Pac Tech USA Offering Contract Wafer Bumping, Stencil Services

Industry News | 2003-01-27 10:27:31.0

At a New Facility Within the Company's U.S. Headquarters

SMTnet

How to Prevent Non-Wetting Defect during the SMT Reflow Process

Industry News | 2018-10-18 08:21:10.0

How to Prevent Non-Wetting Defect during the SMT Reflow Process

Flason Electronic Co.,limited

Mid-Atlantic Advanced Learning Session on Failure Analysis, Technical Presentations and Live Q&A Panel Discussion; September 7th – 10th

Industry News | 2021-08-13 12:58:35.0

The SMTA Capital Chapter, Carolinas Chapter and Philadelphia Chapter are excited to host their first ever tri-chapter event, Mid-Atlantic Advanced Learning Session - Failure is Never an Option, A Deep Dive into Failure Analysis.

Surface Mount Technology Association (SMTA)

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Industry News | 2018-12-08 03:29:29.0

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Flason Electronic Co.,limited

RoHS Guide in Electronics: RoHS, WEEE and Lead-Free FAQ

Industry News | 2018-12-08 03:24:24.0

RoHS Guide in Electronics: RoHS, WEEE and Lead-Free FAQ

Flason Electronic Co.,limited

SMTA International 2014 Best Papers Announced

Industry News | 2015-01-07 15:52:18.0

The SMTA is pleased to announce the Best Papers from SMTA International 2014. As speakers at SMTA International, individuals make contributions to the industry by sharing their research and findings. To reward exceptional achievement, $1,000 awards and plaques are given for the Best of Conference Presentation, Best of Proceedings Paper, and the Best International Paper.

Surface Mount Technology Association (SMTA)

IPC APEX EXPO 2014 TECHNICAL CONFERENCE SPOTLIGHTS CHANGING TECHNOLOGIES

Industry News | 2014-02-03 18:00:07.0

Changing technologies that are driving the electronics industry will be center stage throughout the IPC APEX EXPO® technical conference, which takes place Tuesday, March 25 to Thursday, March 27, 2014, at the Mandalay Bay Convention Center in Las Vegas.

Association Connecting Electronics Industries (IPC)

Best Technical Papers at IPC APEX EXPO 2022 Selected

Industry News | 2022-01-14 17:06:40.0

Expanded technical conference award categories include NextGen and Student Research

Association Connecting Electronics Industries (IPC)

Elimiate solder voids online we show you how

Industry News | 2015-03-16 06:51:04.0

Void Formation in Solder Joints – Causes & Cures Webinar Monday 18th May 2.30pm GMT Voiding in solder joints is not new we have experienced cavities in solder joints during the introduction of through hole, surface mount and more recently area array technology. In many cases we never knew we have had voids till the introduction of x-ray inspection.

ASKbobwillis.com

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