Industry News | 2013-01-02 16:01:34.0
A Convenienient and informative online tutorial about Design and Assembly Process Challenges for Bottom Terminations Components
Industry News | 2013-07-24 16:39:34.0
IPC — Association Connecting Electronics Industries® announces that IPC APEX India™ will offer a comprehensive program of both half- and full-day workshops designed to help engineers find solutions to their most pressing concerns in electronics manufacturing.
Industry News | 2013-07-24 22:01:53.0
IPC — Association Connecting Electronics Industries® announces that IPC APEX India™ will offer a comprehensive program of both half- and full-day workshops designed to help engineers find solutions to their most pressing concerns in electronics manufacturing.
Industry News | 2011-05-03 22:50:52.0
Assemblers who have tried to resolve problems that stem from the rapidly growing array of advanced packages are getting some help from IPC with the newly released IPC-7093, Design and Assembly Process Implementation for Bottom Termination Components. This standard describes the critical design, assembly, inspection, repair, and reliability issues associated with bottom termination components (BTCs) whose external connections consist of metallized terminals that are an integral part of the component body.
Industry News | 2018-10-18 08:40:47.0
Stencil aperture considerations for QFN chips
Industry News | 2010-07-22 22:37:02.0
IPC — Association Connecting Electronics Industries® has released the B revision of IPC-7351, Generic Requirements for Surface Mount Design and Land Pattern Standard. The leading industry standard for surface mount land pattern design and layout, IPC-7351B provides designers and printed board fabricators with updated guidance on requirements of land pattern geometries used for the surface attachment of electronic components, as well as surface mount design recommendations for achieving the best possible solder joints.
Industry News | 2018-12-08 03:15:55.0
SMT Book – Surface Mount Technology Book PDF
Industry News | 2018-12-08 03:17:14.0
SMT Book – Surface Mount Technology Book PDF
Industry News | 2020-12-18 11:26:19.0
Good-Ark Semiconductor's Low Capacitance DFN0603 Supplies Low Leakage, Fast Response and Bi-Directional TVS in 0603 Package
Industry News | 2021-04-22 17:10:07.0
New ESD-Protection Diode with Wettable Flanks Features Low Capacitance to 0.37pF typical in the Compact DFN1110-3A Package
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