Industry News | 2016-09-21 15:44:21.0
From booth #936 at the upcoming SMTA International event in Rosemont, Illinois, Henkel Adhesive Electronics’ display will underscore why the company leads the market in comprehensive assembly materials technologies. With multi-award-winning LOCTITE GC solder materials, a broad range of leading-edge thermal management technologies, and new applications for TECHNOMELT products, the Henkel booth is the go-to destination for advanced electronics assembly materials.
Industry News | 2021-11-05 07:35:56.0
Acquisition lays groundwork for a breakthrough: Microchips placement as part of additively manufactured electronics solution
Industry News | 2003-04-25 08:01:00.0
Initiates Q3 revenue guidance of $190 - $200 million, Outlines $12 million restructuring plan
Industry News | 2017-03-06 12:24:15.0
Last month at the IPC APEX Expo event in San Diego, California, Henkel’s TECNOMELT AS 8998 hot melt masking material was presented with a Circuits Assembly NPI award in recognition of its ability to meet several criteria, including: creativity and innovation, compatibility with existing technology, cost-effectiveness, design, expected reliability, flexibility, speed/throughput improvements, performance, user-friendliness, and expected maintainability and reparability. The award capped off what has been a successful first year for TECHNOMELT AS 8998, which was commercialized in early 2016 and has already lowered cost and improved operational efficiency at several global electronics manufacturers.
Industry News | 2016-03-27 14:19:07.0
Henkel Adhesive Technologies’ award-winning Technomelt® materials have long been recognized as the industry standard for high-performance low pressure molding applications. Extending the effectiveness of the portfolio outside of proven encapsulation processes, a newly-formulated Technomelt is now also providing a streamlined and economical alternative to conventional masking techniques for various coating requirements.
Industry News | 2016-03-30 09:04:09.0
Adding functional capability to its award-winning Technomelt® hot melt encapsulants, Henkel Adhesive Technologies today announced another formulation milestone with the development of a thermally conductive Technomelt material. With the ability to transfer heat through the encapsulating layer, thermally conductive Technomelt products offer dual-function performance in a single material solution.
Industry News | 2003-02-07 08:51:46.0
An Earnings Conference Call is Scheduled for Thursday, February 6, 2003, at 9:00 a.m. EST.
Industry News | 2003-05-13 08:22:33.0
Revenues for the first quarter of 2003 totaled $54.2 million, compared to the $51.1 million recorded in the first quarter a year ago.
Industry News | 2018-03-16 08:13:49.0
As a leading solder materials innovator, Henkel recognizes the need for more holistic solder paste process analysis, especially as device miniaturization and finer particle size solders become mainstream. While many suppliers and manufacturers use proprietary solder material evaluation tools, there is a requirement for easily-implemented, standardized test vehicles that address the realities of today’s manufacturing complexities, particularly in the process areas of printing and reflow. The electronics business of Henkel Adhesive Technologies has developed such a tool.
Industry News | 2002-05-06 08:19:39.0
Revenues for the First Quarter of 2002 Totaled $51.1 Million
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