Industry News | 2019-10-29 02:58:23.0
Fast dehumidifying series dry cabinet announced!
Industry News | 2019-11-05 22:17:26.0
Plated half holes（castellated holes）are holes that made off the edge of the boards plated with copper using a specialized process. It is predominantly used for board-on-board connections, mostly where two printed circuit boards with different technologies are combined. Through connecting the PCBs together directly, the whole system is considerably thinner than a comparable connection with multi-pin connectors.The plated edges are also useful in producing mini PCB modules.
Industry News | 2019-11-27 01:33:15.0
ULT AG recently introduced the mobile soldering fume extraction unit LRA 160.1 for small and medium air pollutant quantities
Industry News | 2020-04-30 12:05:37.0
Seika Machinery, Inc. is pleased to offer the new PCU-285 Spiral Viscometer and DS-10S Dip Tester for Selective Solder from Malcom.
Industry News | 2022-05-16 16:04:54.0
New Vishay MCB RAME012 Position Sensor Delivers High Performance in Miniature Size for Military and Industrial Applications
Industry News | 2021-11-30 20:11:40.0
ASHCROFT pressure transmitter is one of the most commonly used transmitters in industrial applications. It is widely used in a variety of control environments, involving water conservancy and hydropower, railway transportation, intelligent building, production automation, aerospace, military, petrochemical, oil wells, electric power, ships, machine tools and pipelines.
Industry News | 2009-08-19 13:06:06.0
Extending its capabilities for placing solder spheres at high speed, DEK’s proven DirEKt Ball Placement™ process now enables accurate solder sphere deposition for spheres as small as 200µm in diameter with pitches as tight as 300µm. With the ability to achieve this accuracy and precision at a first pass yield of over 99.99%, DirEKt Ball Placement delivers the speeds necessary for modern package manufacture without sacrificing anything in the way of performance.
Industry News | 2012-09-04 08:51:32.0
Hesse & Knipps, Inc., (www.hesse-knipps.com) has added the HBK08 Loop Former Bondhead to its BONDJET BJ935 and BONDJET BJ939 fully automatic heavy wire bonders to support growing requirements for high density module bonding.
Industry News | 2012-09-13 19:31:07.0
OK International,announces it will exhibit in booth #617 at the upcoming SMTA International Conference and Expo,
Industry News | 2013-09-14 09:00:12.0
Essemtec will exhibit in booth #827 at the upcoming SMTA International Exhibition, scheduled to take place October 15-16, 2013 at the Fort Worth Convention Center in Texas.
