Industry News | 2022-01-29 13:28:14.0
Indium Corporation has expanded its manufacturing capabilities to include a fine diameter 0.004" (0.10mm) flux-cored wire made with select Pb-free alloys to help customers meet the progressively demanding requirements of fine-pitch applications.
Industry News | 2012-05-11 20:19:04.0
Hesse & Knipps, Inc., the Americas subsidiary of Hesse & Knipps Semiconductor Equipment GmbH, will discuss "Large Diameter Wedge Bonding of Round and Ribbon Wire for Automotive Applications" during IMAPS 3rd Advanced Technology Workshop and Tabletop Exhibition on Automotive Microelectronics and Packaging, taking place at the Dearborn Hotel in Dearborn, Michigan May 22-24, 2012.
Industry News | 2016-12-01 19:11:53.0
Metcal today announced the global launch of the Solder Wire Feeder System. The feeder system speeds up the soldering process and increases efficiency by adding control and convenience to the line.
Industry News | 2020-08-07 05:26:41.0
Accu-Assembly Inc. is pleased to introduce AccuStock™, a fully automatic electronic reel component storage and retrieval system (ASRS) and the first TOTAL Automatic Storage and Retrieval System for different sizes of SMT component reels. Requiring minimal operator assistance, AccuStock accurately stores and retrieves up to 8,000 reels of different diameters and thicknesses, all in one machine.
Industry News | 2008-11-06 16:09:16.0
COLORADO SPRINGS, CO � November 5, 2008 � FINE LINE STENCIL, a division of FCT Assembly and a leading manufacturer of stencil products, announces the purchase of the industry's most advanced stencil laser.
Industry News | 2010-12-01 15:42:43.0
Christopher Associates introduces the S3X-BF70M and 200N series wafer bumping pastes. The pastes exhibit a high definition over time and at elevated temperatures.
Industry News | 2011-02-10 12:52:31.0
Christopher Associates Inc. introduces the Machvision Hole Doctor - II, the most advanced hole verification system on the market.
Industry News | 2012-08-20 13:00:35.0
Multitest, announces that its Pulse Plating Process provides significant advantages in terms of fabrication cost and cycle time.
Industry News | 2012-08-20 13:01:17.0
Multitest, announces that its Pulse Plating Process provides significant advantages in terms of fabrication cost and cycle time.
Industry News | 2019-11-05 22:19:03.0
> News-Blog > Guideline for wire bonding Guideline for wire bonding Tuesday,Jun 12,2018 There are two wire bonding processes that are used, Thermosonic (T/S) Gold Ball Wire Bonding and Ultrasonic (U/S) Aluminum Wedge Wire Bonding. Approximately 90% of all IC Assembly in Semiconductor Packages is manufactured using Gold Ball Bonding process, while Aluminum Wedge Bonding is used to produce about 10% of other Wire Bonding requirements on Printed Circuit Boards (PCB), Printed Circuit Flex (PCF) and other Packages.
