Industry News: diamond blade (Page 1 of 1)

Depaneling Saws for Low Stress PCB Singulation

Industry News | 2020-07-01 12:08:16.0

For high precision low stress PCB singulation of panels with sensitive components near the parting edge, and with the smooth edge finish required by military specifications or by packaging considerations, using a Diamond Blade Saw beats routing for speed and for blade life. The saw blade, a 2.95" (75mm) diameter .021" thick diamond coated cutting disk, provides a low-stress, ultra smooth edge finish for separting panelized Printed Circuit Cards. ts which overhang the parting line will remain intact.

FKN Systek

Summer Sizzler Sale! Now through August 31st!

Industry News | 2008-07-30 08:36:31.0

Save up to 40% on nozzles, parts, consumables, cutter blades and more!

Count On Tools, Inc.

Summer Sizzler Sale

Industry News | 2008-07-07 10:58:48.0

Save up to 40% on nozzles, parts, consumables, cutter blades and more!

Count On Tools, Inc.

Seika Names Ceiba Technologies, Inc. as a Top McDry and Sawa Sales Representative

Industry News | 2010-04-11 04:22:59.0

TORRANCE, CA — Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, awarded Ernesto Bader from Ceiba Technologies, Inc. third place for being one of its top McDry and Sawa Sales Representatives in 2009. The award was presented to the company during a Wednesday, April 7, 2010 ceremony that took place in the Mandalay Bay Resort & Convention Center in Las Vegas during APEX 2010.

Seika Machinery, Inc.

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