Industry News: dice (Page 2 of 4)

DEK Galaxy Platform Enables LORD Corporation’s Product Development Initiatives

Industry News | 2009-08-20 15:26:58.0

To progress development of its next-generation pre-applied underfill materials, LORD Corporation has selected DEK’s award-winning Galaxy platform. LORD, a Cary, North Carolina-based leading manufacturer of electronic materials, found the precision, accuracy and process capability of the Galaxy simply unmatched and, therefore, the ideal system to enable its materials innovation initiatives.

ASM Assembly Systems (DEK)

Full Probe Card Test

Industry News | 2021-07-15 03:55:39.0

The latest fixtureless technology available for production and validation testing the most challenging Probe Cards

SEICA SpA

Panasonic Flip Chip Bonder to Make North American Debut at Semicon

Industry News | 2014-06-25 12:31:01.0

Panasonic Factory Solutions Company of America will debut a process-flexible flip chip bonder at this year’s Semicon West as part of its high-speed, low-cost manufacturing solutions for highly advanced devices.

Panasonic Factory Solutions Company of America (PFSA)

Discover ViTrox's Latest and Advanced Wafer Inspection Solution – the Wi8i G2 PRO!

Industry News | 2023-02-10 01:14:47.0

Wafer inspection is always a critical stage for quality assurance for wafer foundry, integrated device manufacturing (IDM), fabless, and outsourced semiconductor assembly & test (OSAT). Since semiconductor devices are continuously getting smaller and more complex, the requirement for wafer inspection has become more stringent to accommodate these changes. At ViTrox, we aim to be the World's Most Trusted Technology Company in providing innovative, advanced, and cost-effective automated Machine Vision Inspection Solutions. Therefore, we would like to introduce our all-new Wi8i G2 PRO Wafer Vision Inspection Handler, which is designed to offer high flexibility in wafer handling, cover different semiconductor processes and high-accuracy inspection results to the users of the semiconductor market.

ViTrox Technologies

Essemtec Introduces FLX2010C System with Vacuum Downholder for Flex Board Component Placement

Industry News | 2008-09-08 03:46:39.0

Essemtec AG, a leading manufacturer of surface mount technology production equipment, announces that it has worked with leading suppliers of die bonders to develop a highly economical solution for the efficient placement of special components on film or flex boards, providing many benefits to the users.

ESSEMTEC AG

LPKF to Exhibit the Latest in Laser Technology at MD&M West Conference and Expo 2012

Industry News | 2012-01-17 15:25:04.0

LPKFwill be exhibiting in booth #570 at the upcoming MD&M West Conference and Expo, scheduled to take place February 14-16, 2012 at the Anaheim Convention Center in Anaheim, CA.

LPKF Laser & Electronics

Panasonic Selects Creyr Innovation as Microelectronics Sales Rep

Industry News | 2014-02-04 15:04:31.0

Creyr Innovation has been selected by Panasonic Factory Solutions Company of America as a value-added sales representative for microelectronics solutions in the New England area.

Panasonic Factory Solutions Company of America (PFSA)

AI Technology, Inc. (AIT) Increases Manufacturing Capacity of Advanced 10 Micron Wafer Level Die-Attach Film (DAF)

Industry News | 2014-04-10 10:17:27.0

AI Technology has just increased its manufacturing capacity to more than 10 million square feet of its 10 micron thick ESP7660 series of insulating DAF for memory stacked chip applications and its 20 micron thick ESP8660 series of conductive DAF for power devices.

AI Technology, Inc. (AIT)

AI Technology (AIT) Introduces Novel High Temperature Large Area Underfill with Proven Stress Absorption

Industry News | 2014-07-28 13:56:52.0

240°C and novel stress absorbing capabilities to allow long-term reliability of large area flip-chip devices.

AI Technology, Inc. (AIT)


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