Industry News | 2008-06-26 14:36:27.0
Building on its decades of materials deposition expertise, DEK has developed several unique advanced technology systems to enable next-generation semiconductor packaging and solar cell production processes. At the upcoming Semicon West event, scheduled for July 15 � 17 at San Francisco�s Moscone Center, DEK will display some of these latest innovations along with its new VectorGuard� Platinum stencil technology.
Industry News | 2013-03-11 09:10:32.0
A FINEPLACER® Pico bonder has been installed at the MEMS Nanoscale and Devices Group at Pennsylvania State University.
Industry News | 2023-09-14 17:50:57.0
SHENMAO America, Inc. is proud to introduce its latest innovation in response to the growing demand for ultra-thin packages in the electronics industry. With the increase in package thinness, the challenge of package warpage and its impact on production yield has become more pronounced.
Industry News | 2002-03-19 08:04:17.0
ESEC received a 2001 Preferred Quality Supplier (PQS) award from Intel Corp. for outstanding performance in providing products and services deemed essential to Intel's success. The company was awarded for its efforts in supplying Intel with flip chip attach equipment and die bonders.
Industry News | 2016-10-11 19:03:14.0
Nordson MARCH received the 2016 Global Technology Award for its FlexTRAK®-CDS high-volume plasma system at a ceremony held in conjunction with the SMTA International conference in Rosemont, IL on September 27, 2016. The system removes contamination, etches surfaces to improve adhesion, and provides surface activation prior to die attach, wire bond, mold encapsulation, and underfill to lead frame strips, laminated substrates, and other strip-type electronic components.
Industry News | 2022-04-13 10:29:39.0
Heraeus Electronics today announced plans to exhibit in Hall 6, Booth 322 at PCIM Europe, the leading conference and exhibition for power electronics, renewable energy and energy management. The event is scheduled to take place May 10-12, 2022 in Nuremberg. In parallel to PCIM Europe, SMTconnect will take place in halls 4, 4A and 5.
Industry News | 2023-01-23 17:37:22.0
Indium Corporation® will feature selections from its portfolio of proven products for automotive and power electronics applications, including electric vehicles, at NEPCON Japan, January 25‒27 in Tokyo, Japan.
Industry News | 2014-07-28 13:56:52.0
240°C and novel stress absorbing capabilities to allow long-term reliability of large area flip-chip devices.
Industry News | 2004-10-06 15:21:47.0
Indium Corporation of America announced the opening of their newest facility. Located in the Suzhou Industrial Park in Jiangsu, China, the facility houses solder paste manufacturing and quality operations as well as fully integrated sales and technical support teams.
Industry News | 2004-10-15 16:35:07.0
To meet the high demand of water-soluble solder paste users who need to comply with the Pb-Free requirements, Indium Corporation of America has developed the next generation of Pb-Free Solder Paste, Indium3.1.
