Industry News: die attach (Page 18 of 43)

Indium�s Dr. Lee and Dr. Lasky to Present at APEX

Industry News | 2005-01-11 11:17:37.0

Indium Corporation�s VP of Technology, Ning-Cheng Lee, Ph.D and Senior Technologist, Ronald C. Lasky, Ph.D., PE, will both be presenting courses on Pb-Free electronic assembly at APEX in Anaheim, CA in February.

Indium Corporation

Indium Corporation Appoints New Applications Engineers

Industry News | 2005-09-04 07:42:56.0

Indium Corporation announced the appointment of three new Applications

Indium Corporation

Indium Corporation to Feature WEEE/RoHS Compliant Materials at Productronica

Industry News | 2005-10-20 11:39:06.0

Indium Corporation will be exhibiting its Suite of Pb-Free Electronics Assembly Materials for WEEE and RoHS compliance at the Productronica show in Munich, Germany on November 15-18, 2006.

Indium Corporation

Indium Corporation�s NF260 Wins Third Prestigious Award

Industry News | 2006-04-17 11:14:44.0

Indium Corporation�s NF260 No-Flow Underfill was awarded the 2006 EM Asia

Indium Corporation

Reliability the Focus of Indium Corporation at Nepcon East/Electro

Industry News | 2006-04-20 12:26:41.0

Indium Corporation will highlight its Reliability Program at their exhibit at Nepcon East/Electro, May 10-11, 2006 in Boston, MA. Indium�s team of experts will be available at booth #3017 to answer questions and provide information.

Indium Corporation

Indium Corporation�s Dr. Ning-Cheng Lee and Dr. Ronald Lasky to Present at Lead-Free Workshop

Industry News | 2006-09-28 13:40:04.0

Indium Corporation�s Vice President of Technology, Ning-Cheng Lee, Ph.D., and Senior Technologist, Ronald C. Lasky, Ph.D., PE, will present at Implementing Lead-free: A Hands-on Workshop, October 16-19, 2006 at the Rochester Institute of Technology (RIT) Campus in Rochester, NY USA.

Indium Corporation


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