Industry News | 2007-01-09 12:25:38.0
January 9, 2007
Industry News | 2007-04-03 12:58:45.0
04/03/2007
Industry News | 2007-05-02 12:18:23.0
Indium Corporation�s Indium5.1AT Pb-Free Solder Paste was awarded the Innovation Award at Nepcon China in Shanghai, China.
Industry News | 2009-07-14 17:50:29.0
Carlsbad, CA – July 14th, 2009: Machine Vision Products today announced it would be demonstrating the Ultra 850G Semiconductor, Packaging and MicroElectronics AOI solution at the Semicon West 2009 exhibition at the Moscone Center in San Francisco between 14th and 16th July at booth 743 in the South Hall.
Industry News | 2009-09-17 17:02:12.0
EAST HANOVER, NJ – Zymet has introduced a new reworkable underfill encapsulant, CN-1728, designed to underfill Package-on-Package (POP) assemblies. Underfilled POP’s have greater difficulty in passing thermal cycle tests than underfilled BGA’s. Compared to earlier generation underfills, CN-1728 has a lower coefficient of thermal expansion and higher Tg, and better compatibility with flux residues, both of which contribute to its superior thermal cycle performance.
Industry News | 2010-03-17 18:31:55.0
EAST HANOVER, NJ – Zymet has introduced a new silica-filled reworkable board-level underfill encapsulant, X2825, whose coefficient of thermal expansion, CTE, is 26 ppm/°C. The underfill enhances drop and shock test reliability and, compared to higher CTE underfills, provides superior thermal cycle performance.
Industry News | 2012-01-24 17:11:07.0
Finetech will highlight the FINEPLACER® core rework system in Booth #3020 at the upcoming IPC APEX Expo,.
Industry News | 2012-10-03 16:55:18.0
Finetech will highlight the FINEPLACER® core rework system in the Finetech/Martin Booth #236 at the upcoming SMTA International Conference and Expo
Industry News | 2013-01-16 13:48:03.0
Finetech will highlight the FINEPLACER® core rework system in booth #1205 at the upcoming IPC APEX EXPO
