Industry News | 2018-09-05 20:16:30.0
Engineered Material Systems debuts CA-188-1 low-temperature cure electrically conductive adhesive for die attach and general circuit assembly applications.
Industry News | 2024-01-29 11:36:51.0
Indium Corporation® will feature its high-reliability, Au-based precision die-attach (PDA) preforms for critical laser and RF applications at SPIE Photonics West, Jan. 27-Feb. 1, in San Francisco. SPIE West is the world's premier event for lasers, biomedical optics and biophotonic technologies, quantum, and optoelectronics.
Industry News | 2009-11-19 14:48:22.0
Broadening its well-known Multicore die attach solder portfolio, which already includes Multicore DA100 solder paste for high-lead and lead-free applications, Henkel today announced the launch of Multicore DA101. This newest formulation delivers many of the well-known benefits of Multicore DA100, but has been designed for screen print operations, thus offering flexibility for varying process requirements.
Industry News | 2019-01-15 19:43:33.0
Engineered Material Systems is pleased to debut its TM-6520 low temperature cure adhesive. Designed for die attach and general circuit assembly applications, the adhesive is electrically insulating and offers high thermal conductivity.
Industry News | 2014-04-10 10:17:27.0
AI Technology has just increased its manufacturing capacity to more than 10 million square feet of its 10 micron thick ESP7660 series of insulating DAF for memory stacked chip applications and its 20 micron thick ESP8660 series of conductive DAF for power devices.
Industry News | 2016-01-05 14:46:38.0
Indium Corporation will feature precision gold-tin (AuSn) solder preforms for die-attach at AeroDef 2016, Feb. 8-10, in Long Beach, Calif. AuSn preforms are designed for high-reliability applications, such as aerospace, defense, and medical.
Industry News | 2002-03-13 07:31:38.0
Loctite Corp. has been named a recipient of Intel Corp.'s (Chandler, AZ) 2001 Supplier Continuous Quality Improvement (SCQI) award for outstanding commitment to quality and performance by suppliers providing products and services deemed essential to Intel's success. The company was recognized for its efforts in supplying Intel with die attach adhesives and underfill materials. All SCQI award winners will be honored at a celebration in Burlingame, CA on March 13, 2002.
Industry News | 2015-05-04 16:04:54.0
Engineered Material Systems introduces its newest conductive adhesive – CA-180. The low-temperature cure conductive adhesive has been designed for die attach and general circuit assembly applications.
Industry News | 2017-12-03 18:33:48.0
Engineered Material Systems is pleased to debut its CA-183 low temperature cure electrically conductive adhesive. The low cost, flexible adhesive is designed for die attach and general circuit assembly applications.
Industry News | 2020-11-09 14:21:48.0
SHENMAO America, Inc. is pleased to introduce its newly developed Joint-Enhanced FluxSMEF-Z3. The new no-clean flux has been designed for fine-pitch assembly and LED die attach.
