Industry News | 2022-02-10 17:05:35.0
The development of a novel high-temperature lead-free solder for die-attach in power discrete applications will be the focus of a presentation by Indium Corporation's Dr. HongWen Zhang at APEC 2022, March 20-24, Houston, Texas, U.S.
Industry News | 2018-07-19 20:30:51.0
SHENMAO America is pleased to introduce the PF606-PW215 water-soluble solder paste. The company offers a full line of water-soluble fluxes and solder pastes for SMT and IC packaging applications. SHENMAO provides halide-containing and halide-free fluxes for tin/lead as well as lead-free solder alloys.
Industry News | 2020-12-01 02:52:15.0
SHENMAO America, Inc. is pleased to introduce its Joint-Enhanced Solder Paste (JEP) PF606-EP Series. JEP offers the advantages of both traditional solder paste and anisotropic conductive paste.
Industry News | 2023-09-04 13:36:25.0
Indium Corporation Senior Area Technical Manager Jason Chou will present at SEMICON Taiwan on September 7, in Taipei, Taiwan.
Industry News | 2010-04-29 08:33:15.0
SIPLACE CA combines die-bonding and SMT placement to meet current trends in packaging of integrated circuits
Industry News | 2020-10-16 13:51:44.0
The Assembly Division of MacDermid Alpha Electronics Solutions will be presenting the paper, "Alpha Power Electronics Solutions" at the 3rd China Powertrain Electrification and Innovation Summit 2020 – New Energy Vehicle 2.0 Era from October 22-23, 2020 in Shanghai, China.
Industry News | 2013-09-17 15:25:45.0
Nihon Superior announces that its Senior Technical Advisor Keith Sweatman will present at SMTA International, which is scheduled to take place October 12-17 at the Fort Worth Convention Center in Texas.
Industry News | 2021-12-17 16:30:28.0
One of the most highly demanded applications for 80Au20Sn is semiconductor laser die-attach due to recent advancements that have made lasers an economical option for a multitude of new products. However, a key challenge with semiconductor lasers is thermal management, as these devices generate a significant amount of heat. Indium Corporation Product Specialist Jenny Gallery will present on how to manage heat with AuSn preforms at SPIE Photonics West, Jan. 22-27, San Francisco, Calif., U.S.
Industry News | 2019-06-02 18:40:27.0
SHENMAO America, Inc. introduces SMF-WC53 Water Soluble Ball-Attach Flux and Solder Sphere for use in ball-attach processes. With excellent solderability and high reliability, SHENMAO’s solder sphere can be used in a wide range of solder applications with various sizes from 50-760 μm.
Industry News | 2023-08-07 10:18:06.0
Indium Corporation is set to deliver a technical presentation and exhibit its industry-leading products for power electronics assembly at PCIM Asia, August 29-31, in Shanghai, China.
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