Industry News | 2024-02-19 12:00:05.0
Indium Corporation® will feature selections from its portfolio of proven products for automotive and power electronics applications, including electric vehicle manufacturing, at APEC 2024, February 25‒29 in Long Beach, California.
Industry News | 2022-05-05 17:43:39.0
MacDermid Alpha Electronics Solutions will showcase its latest sintering process solutions, including the new ALPHA Argomax AccuLam Sintering Film, at the upcoming PCIM exhibition in Nuremberg, Germany from Tuesday 10th - Thursday 12th May in Hall 7 Booth #227.
Industry News | 2003-09-25 13:32:47.0
Reduce waste and cost.
Industry News | 2004-04-27 15:19:57.0
Zymet has introduced a new reworkable underfill encapsulant, CN-1453, designed for BGA encapsulation. Removal of defective BGA's is easily accomplished by heating the component and the underfill encapsulant to 220°C. Underfill encapsulant residues are easily scraped or brushed off.
Industry News | 2004-09-02 22:58:52.0
Indium Corporation of America will be exhibiting at Assembly Technology Expo (booth # 5631)
Industry News | 2004-09-09 12:55:33.0
Implementing Lead-free Assembly at Your Facility
Industry News | 2004-09-22 14:23:28.0
Indium Corporation of America has introduced Wave Solder Flux 3592-35 specifically developed for the Pb-free wave soldering of mixed-technology and through-hole electronic assemblies.
Industry News | 2004-09-28 13:23:18.0
Indium Corporation of America will be exhibiting at several regional SMTA Trade Shows during the month of October
Industry News | 2004-10-26 14:26:02.0
Indium Corporation of America�s Germanium Chemicals Division has passed its ISO-9001:2000 certification audit.
Industry News | 2004-11-19 14:17:48.0
Indium Corporation of America has announced that GPS has become its newest distributor in the European market, covering Germany, Croatia and Slovenia.
