Industry News: die attach solder paste (Page 13 of 53)

SHENMAO Low-Temperature Solder Paste PF735-PQ10-10 Is Designed for High-Speed Printing Processes

Industry News | 2024-03-18 13:22:09.0

SHENMAO Technology is pleased to announce that its PF735-PQ10-10 Low-Temperature Lead-Free Solder Paste is specifically designed for SMT processes, offering a low melting point to accommodate high-speed printing processes. Designed to meet the evolving needs of the electronics manufacturing industry, PF735-PQ10-10 offers a range of features and benefits to enhance SMT processes and improve production efficiency.

Shenmao Technology Inc.

SHENMAO Launches the SMF-UL51 Ultra-Low-Residue Flux for No-Clean Packaging Processes

Industry News | 2018-09-26 11:50:32.0

SHENMAO America, Inc. is pleased to introduce its SMF-UL51, which is a no-clean, halogen-free, ultra-low-residue spray flux. As the world’s major solder materials provider, SHENMAO produces SMT solder paste, laser soldering paste, cored solder wire, wave solder bar, semiconductor packaging solder spheres, wafer bumping solder paste, flux and solar PV ribbon.

Shenmao Technology Inc.

SHENMAO Showcasing Liquid Flux and Low Temp Solder at SMTA Guadalajara

Industry News | 2019-10-08 06:12:57.0

SHENMAO America, Inc. is pleased to announce plans to exhibit at the SMTA Guadalajara Expo & Tech Forum, scheduled to take place Oct. 23-24, 2019 at the Expo Guadalajara. The company will show its PF735-PQ10 Low Temperature Solder (LTS) and SM-862 Liquid Flux in Booth #602.

Shenmao Technology Inc.

Advanced Liquid Flux and Low Temp Solder from SHENMAO at SMTA Silicon Valley Expo

Industry News | 2019-11-25 11:02:32.0

SHENMAO America, Inc. announces that it will exhibit at the SMTA Silicon Valley Expo, scheduled to take place Wednesday, Dec. 4, 2019 at the Bestronics Box Build Facility in San Jose, CA. The company will showcase its PF735-PQ10 Low Temperature Solder (LTS) and SM-862 Liquid Flux.

Shenmao Technology Inc.

SHENMAO Introduces Cutting-Edge Low-Temperature Lead-Free Solder Wire PF735-LT201

Industry News | 2023-08-14 12:12:00.0

SHENMAO America, Inc. is pleased to announce the availability of its PF735-LT201 Low-Temperature Lead-Free No-Clean Solder Wire. This advanced solder wire is designed to meet the evolving needs of the electronics industry, offering exceptional solderability and reliability for low-temperature PCBA soldering and rework processes.

Shenmao Technology Inc.

SHENMAO Develops Thermal Fatigue-Resistant Solder Paste PF918-P250 for High-Reliability Requirements

Industry News | 2024-06-10 10:22:35.0

SHENMAO Technology proudly announces the development of its new thermal fatigue-resistant solder paste, PF918-P250. Designed to meet high-reliability requirements, PF918-P250 offers advanced features and superior performance for electronic products requiring exceptional durability.

Shenmao Technology Inc.

SHENMAO Provides Quality Solder Paste for SMT Assembly

Industry News | 2019-04-01 19:56:55.0

SHENMAO America, Inc. provides a variety of solder paste products for SMT assembly including Tin Lead Solder Paste, Lead-Free Solder Paste, Water-Soluble Solder Paste, Package-on-Package Solder Paste, Low-Temperature Solder Paste, and Halogen-Free Solder Paste.

Shenmao Technology Inc.

Shenmao Recycled Solder Materials to Be Certified to UL ECVP 2809

Industry News | 2022-09-08 06:51:46.0

Shenmao America, Inc. is pleased to announce that four of its solder materials have received UL ECVP 2809 (UL Environmental Claim Validation Procedure, UL ECVP) for Recycled Content Standard which now includes auditing of social responsibility procedures. Additionally, more of its recycled tin products will be UL certified in the near future.

Shenmao Technology Inc.

SHENMAO Offers Halogen-Free SM-862 Liquid Flux as a Replacement for SM-816

Industry News | 2023-07-19 09:24:50.0

SHENMAO America, Inc. is pleased to announce the availability of its halogen-free SM-862 Liquid Flux, designed to replace the widely used halogenated SM-816. The SM-862 Flux offers a range of benefits, including low solid content and smooth residue, making it an excellent choice for automatic wave soldering and manual dipping processes.

Shenmao Technology Inc.

SHENMAO to Present at the 31st Annual Electronics Packaging Symposium

Industry News | 2019-08-12 20:00:01.0

SHENMAO America is pleased to announce that it will exhibit at the 31st Annual Electronics Packaging Symposium- Small Systems Integration, scheduled to take place Sept. 5-6, 2019 in Binghamton, NY. Watson Tseng, General Manager, SHENMAO America, will present “New-Generation, Low-Temperature Lead-Free Solder for SMT Assembly.”

Shenmao Technology Inc.


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