Industry News | 2024-02-12 13:43:22.0
SHENMAO Technology is pleased to announce the availability of its latest innovation, the SMF-D61 Low Residue No-Clean Flip Chip Flux. This advanced flux is meticulously engineered to meet the demanding requirements of flip chip dipping applications, offering exceptional performance and reliability throughout the soldering process.
Industry News | 2023-10-31 18:58:18.0
SHENMAO America, Inc. is proud to announce that it received a 2023 Mexico Technology Award for its groundbreaking SMBF-08 Visible No-Clean BGA Flux. The award was announced at a ceremony on Wednesday, Oct. 25, 2023 during the SMTA Guadalajara Expo. This innovative flux has redefined surface mount technology (SMT) assembly and BGA ball mount processes, offering unparalleled visibility and performance.
Industry News | 2024-01-15 14:05:01.0
SHENMAO Technology announces a strategic expansion initiative with the establishment of a new factory in Texas. The move reflects the company's commitment to meeting the growing demand for its high-quality solder products, particularly in the automotive sector. SHENMAO anticipates that the new facility will significantly enhance its production capacity, catering to the needs of key clients, including major players in the electric vehicle manufacturing sector.
Industry News | 2016-04-21 00:17:09.0
SHENMAO Technology will present the technical paper "A New Dispensing Solder Paste for Laser Soldering Technology" at the 10th. Anniversary of the SMTA International Conference of Soldering and Reliability 2016 in Toronto, Canada, featuring advancements in newly developed composition of Powder, Fluxes and produces best dispensability, minimal flux residue, no-splash or solder balling issues and minimal and smaller voids.
Industry News | 2023-11-20 15:25:15.0
SHENMAO Technology is proud to commemorate its 50th anniversary. Founded in 1973, SHENMAO has witnessed the evolution of Taiwan's electronics industry, playing a pivotal role in shaping the landscape of solder materials and setting new industry standards.
Industry News | 2008-12-06 02:17:55.0
Further advancing the capabilities of modern die attach technology, Henkel has developed and made commercially available a line of new Ablestik� brand die attach materials known as self-filleting die attach. The new class of die attach products offers all of the benefits of traditional die attach pastes, but takes the adhesive technology further by incorporating a self-filleting mechanism, making it a viable and much less costly alternative to die attach films.
Industry News | 2023-12-18 13:13:45.0
SHENMAO Technology proudly unveils its latest innovation, the PF918-P250 no-clean solder paste, specifically designed to meet the stringent demands of automotive applications. With a focus on enhancing thermal impact reliability, PF918-P250 sets a new standard for performance, delivering superior results for automotive devices and high-power components.
Industry News | 2019-10-08 06:05:58.0
SHENMAO America, Inc. is pleased to announce that it will exhibit at the SMTA Long Island Expo & Tech Forum, scheduled to take place Thursday, October 17, 2019 at the Melville Marriott in Melville, NY. The company will showcase its PF735-PQ10 low temperature solder (LTS) and SM-862 Liquid Flux.
Industry News | 2010-07-06 11:20:59.0
Techcon Systems, a product group of OK International and a leading provider of fluid dispensing systems and products, announces that it has released a data sheet for its TS7000 Series Interchangeable Material Path (IMP) Rotary Valve. The TS7000 is the latest addition to Techcon’s rotary micro-valve family.
Industry News | 2019-08-21 17:00:15.0
Nihon Superiorwill exhibit in Booth #518 at 2019 SMTA International. The company will celebrate the achievements produced by the well-known SN100C® lead-free alloy. TipSave N flux-cored solder wire will be introduced and SN100CVTM P608 D4 solder paste will be shown.
