Industry News | 2007-10-30 15:33:05.0
DORSET, UNITED KINGDOM - October 31, 2007 - Speedprint Technology Ltd., a division of Blakell Europlacer Group, announces that it will showcase various systems and technologies in booth A4-125 at the upcoming Productronica 2007 exhibition and conference scheduled to take place November 13-16, 2007 at the New Munich Trade Fair Center in Munich, Germany.
Industry News | 2010-06-21 16:04:54.0
Demonstrating its extensive knowledge base for today’s demanding back-end wafer level processes, DEK’s presence at the upcoming Semicon West event in San Francisco, California will feature the Galaxy print platform with Wafer Transport Solution. This system, displayed alongside the CHAD WaferMate 300-1, is configured with a precision wafer pallet and high-performance transport rails, ensuring the accuracy and stability required for DEK’s established and emerging cost-effective Wafer Level Packaging (WLP) applications.
Industry News | 2010-09-22 12:24:01.0
High demands on quality in development production
Industry News | 2012-04-02 11:33:24.0
Three-dimensional (3-D) MID products are finding ever-widening applications, especially in the automotive industry. These 3-D electronics assemblies are used when small dimensions are required and the circuits must be optimally fit into a product. In order to ensure 100 percent quality here as well, Viscom has developed an inspection system that inspects these electronics assemblies fully automatically, with short cycle times and high inspection depths.
Industry News | 2017-07-14 13:24:26.0
Saelig Company announces the availability of two new TekBox TBCGx Comb Generators for EMC testing. The TBCG1 is a radiating comb generator with an internal dipole antenna and a base frequency of 100MHz. It radiates a comb spectrum that is characterized up to 6GHz. The comb generator is intended as a quick reference for testing radiated noise measurements in anechoic chambers, TEM/GTEM cells, shielded chambers, or to gauge the effectiveness of cable shielding and other shielding materials.
Industry News | 2018-09-04 10:25:16.0
Seoul, South Korea – Flexible SMT production has entered into a new dimension. Koh Young Technology’s 3D SPI (Solder Paste Inspection) system has now expanded its solution to perform complex dispensing. Koh Young highlighted the latest innovations, including its new high-precision, integrated dispenser for the KY8030-3 3D SPI in Stand 1F45 at NEPCON South China, which occurred August 28-30, 2018 in Shenzhen, China.
Industry News | 2018-10-18 09:49:44.0
NRE and Tooling Costs - What You Need to Know for Your PCB Project
Industry News | 2020-01-15 15:51:08.0
Nordson MARCH, a Nordson company introduces the PROGENY™ plasma treatment system with a chamber that is 2 meters deep with overall dimensions of 660mm W x 2260mm D x 660mm H for plasma treatment of catheters at their full extended length. Plasma cleans and activates the surface prior to applying a lubricious coating and provides adhesive bonding of the balloon to the catheter. It removes contamination, impurities, and organics at the nanometer level and improves surface wettability, hydrophilicity, and bonding capabilities to address issues such as poor wetting, poor coating uniformity, voids, and poor adhesion.
Industry News | 2020-07-06 05:46:26.0
Ant-i2 dual nozzle Offline selective soldering machine
Industry News | 2021-05-31 03:45:39.0
PILOT V8 XL NEXT, THE FLYING PROBER TO ACCOMMODATE BOARDS WITH BIG DIMENSION
