Industry News | 2008-11-18 17:22:43.0
Moulded Interconnected Device (MID) applications are the current focus of the automotive and medical device industries. In such products, circuits are directly applied onto the surface of injection moulded plastic parts or are integrated as part of products. In a 3D-MID, SMD components typically are on multiple levels. Essemtec has developed a system that can dispense and place in three dimensions and is capable of placing 3D-MID technology.
Industry News | 2015-12-16 18:26:09.0
Pulse Electronics Corporation introduces an all-in-one combination antenna and proximity sensor package to optimize the characteristics of both functions, thus enabling better device performance and increased design flexibility for tablets, laptops, and notebook computers. The ProxAnt TL 1.0 is a seven band main antenna, a proximity sensor chip, and all needed components included on the same flexible circuit board. Without requiring physical contact, the sensor recognizes when it is close to the user and sends a signal to the host processor to reduce the transmission power to the antenna, thus lowering SAR. The sensor also recognizes movement to avoid a false trigger.
Industry News | 2011-05-03 22:45:17.0
In an international competition and based on their strong technology, ERSA's reflow systems were selected by another global player located in Scandinavia as the equipment of choice for their production facilities.
Industry News | 2012-06-19 15:55:26.0
MC Assembly™ has integrated multiple Universal Instruments Genesis Series 2 Platform production lines, to include Universal’s Dimensions® Line-level Software Suite to proactively monitor and maximize production efficiency. This newest acquisition continues a lasting collaboration between the two companies and expands MC Assembly’s services offering by benefiting from the improved board size, part range and yield capabilities of the Genesis Series 2 portfolio.
Industry News | 2016-04-19 12:48:48.0
Glenbrook Technologies celebrates 33 years and 2,500 installations of their innovative, world class, x-ray inspection systems developed and manufactured in the U.S.A.
Industry News | 2020-05-28 10:52:31.0
SFI High Attenuation Frameless Enclosures are compact, easy to setup and tear down, and offer excellent EMI isolation on the benchtop
Industry News | 2021-09-08 13:15:05.0
WPI announced the immediate availability of ERMA - the Enhanced Reality Microscope - designed to bring a new dimension of accuracy and speed to electronic assembly and inspection throughout the PCBA Industry. With a range of new patent-pending technologies, ERMA sets a new precedent for workstation throughput.
Industry News | 2003-05-22 08:43:17.0
LaBarge will continue to perform the work at its Joplin, Mo., facility.
Industry News | 2011-12-07 22:27:26.0
SWEMCO has purchased a Universal Instruments Genesis Platform production line. The new equipment set was complemented with Universal’s Dimensions® Line Manager shop floor control software. Both are now operational in SWEMCO’s Moorestown, New Jersey production facility.
Industry News | 2012-04-04 15:31:23.0
Known worldwide for surface-mount adhesive (SMA) development leadership, Henkel has set the industry benchmark with its high-performance Chipbonder brand adhesives. Within the company’s expansive portfolio of SMAs is
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