Industry News | 2017-11-15 20:29:08.0
YXLON International has received a 2017 Global Technology Award in the category of Inspection – X-ray for its YXLON FF35 CT multi-application, high-resolution computed tomography (CT) inspection system for fine parts. The award was presented to the company during a ceremony on Tuesday, Nov. 14, 2017 that took place during productronica in Munich, Germany. The FF35 CT brings a new dimension to electronics X-ray, allowing users to benefit from technology revolutionary in our industry.
Industry News | 2020-09-17 11:53:35.0
With the SelectLine platform, SEHO developed a selective soldering system that provides the highest precision and solder joint quality, and features maximum flexibility even for unusual assembly dimensions.
Industry News | 2014-04-29 23:36:36.0
Seica is once again present at SMT, showcasing a full range of ATE machines for every need, and a lot of innovative solutions for test and selective soldering. Visitors will have the opportunity to see the "new dimension" of test fully represented in the Pilot4DV8. the flying probe system, officially launched at Productronica last year.
Industry News | 2016-09-19 20:08:02.0
Saline Lectronics recently purchased and installed its third StorageSolutions Fortress (ISM2000XL) from Juki. The Fortress is designed for optimal management of larger dimension reels. Now, Lectronics’ three Fortresses will store all of the necessary material to run high-volume assemblies that the company manufactures regularly.
Industry News | 2021-03-02 14:40:54.0
Danutek, daughter company of Altus Group, has added a new dimension to its soldering solutions with the introduction of SMT Thermal Discoveries range of state-of-the-art reflow and vacuum technology.
Industry News | 2021-07-08 05:33:04.0
Laserssel Co., LTD is pleased to introduce its CLSR 6000 high-end Laser Compression Bonder for semiconductor packages. This soldering technique uses high accuracy compression tools and Area Laser bonding introduced with LSRTM(Laser Selective Reflow) in order to minimize warpage on extremely thin packages and substrates. This technology has been adopted for high-end 2.5D packaging with dimensions larger than 60x60mm and NAND modules thinner than 50 µm.
Industry News | 2022-10-06 18:00:57.0
WPI Vision is pleased to announce plans to exhibit in Booth #1222 at SMTA International, scheduled to take place Nov 2-3, 2022 at the Minneapolis Convention Center in Minnesota. The company will debut its new 3D SPECTASCOPE – Enhanced Reality Microscope –designed to bring a new dimension of accuracy and speed to electronic assembly and inspection throughout the PCBA Industry. With a range of new patent-pending technologies, 3D SPECTASCOPE sets a new precedent for workstation throughput.
Industry News | 2022-12-21 10:28:50.0
WPI Vision today announced plans to exhibit at the 2023 IPC APEX EXPO, scheduled to take place Jan. 24-26, 2023 at the San Diego Convention Center in California. The company will showcase its 3D SPECTASCOPE Enhanced Reality Microscope in Booth #3315.
Industry News | 2023-03-06 17:04:54.0
WPI Vision scheduled to take place Tuesday, March 28, 2023 at the Plano Event Center in Texas. The company will demonstrate its 3D SPECTASCOPE Enhanced Reality Microscope. The new 3D SPECTASCOPE brings a new dimension of accuracy and speed to electronic assembly and inspection throughout the PCBA Industry. With a range of new patent-pending technologies, 3D SPECTASCOPE sets a new precedent for workstation throughput.
