Industry News: dimensions of 3d printing machine (Page 7 of 9)

Koh Young USX Series of Inspection Machines for Ultra Large, Heavy Boards Wins Two Prestigious Awards during SMTA Guadalajara

Industry News | 2023-10-31 20:18:28.0

Atlanta, Georgia – Koh Young Technology, the leader in True3D™ measurement-based inspection solutions, proudly announced another pair of innovation awards. This time, Mexico EMS acknowledged the new USX Series of solder paste (SPI), automated optical inspection (AOI), and dispense process inspection (DPI) machines for ultra large, heavy boards with the coveted Editor's Choice Award and the Best New SPI Product Award. Mexico EMS Editor Ron Friedman presented both awards to Koh Young during SMTA Guadalajara on 25 October 2023 at the Westin Guadalajara in Jalisco, Mexico.

Koh Young America, Inc.

Essemtec Premiers New Pick-and-Place System for 3D-MID

Industry News | 2008-11-18 17:22:43.0

Moulded Interconnected Device (MID) applications are the current focus of the automotive and medical device industries. In such products, circuits are directly applied onto the surface of injection moulded plastic parts or are integrated as part of products. In a 3D-MID, SMD components typically are on multiple levels. Essemtec has developed a system that can dispense and place in three dimensions and is capable of placing 3D-MID technology.

ESSEMTEC AG

ViTrox Appoints Richard Osborne as Sales Director of ViTrox Technologies in USA Region

Industry News | 2020-05-31 20:49:40.0

PENANG MALAYSIA - June 2020 - ViTrox Technologies, a world-leading solution provider of innovative, advanced and cost-effective Automated Machine Vision inspection system and equipment for the Semiconductor and Printed Circuit Board industries, is pleased to announce the appointment of Richard Osborne as the new Sales Director of ViTrox Technologies based in USA region.

ViTrox Technologies

Nano Dimension Acquires Essemtec AG, Surface-Mount Pick & Place Systems Supplier for the PCB and OEM Industries

Industry News | 2021-11-05 07:35:56.0

Acquisition lays groundwork for a breakthrough: Microchips placement as part of additively manufactured electronics solution

ESSEMTEC AG

The Murray Percival Company Will Offer Live On-Site Demos of Essemtec’s Solder Paste Jetting Technologies and SMD Storage Systems

Industry News | 2015-10-06 19:21:09.0

Essemtec today announced that The Murray Percival Company will hold an open house from Oct 20-22, 2015 at its facility. The Murray Percival Company will offer live on-site demonstrations of new solder paste jetting technologies and fully automated SMD storage systems from Essemtec.

ESSEMTEC AG

Second generation of the MY500 at APEX 2008 MY500 � Jet Printing technology for higher profitability

Industry News | 2008-04-08 22:40:58.0

With greater PCB design flexibility, more precise solder paste placement and complete off-line preparation, the second generation of the MY500 offers you a vast array of ways to improve your profitability.

Mycronic Technologies AB

ViTrox Appoints Dieter Lang as Business Development Director of ViTrox Technologies GmbH

Industry News | 2020-03-12 01:23:41.0

PENANG MALAYSIA - March 2020 - ViTrox Technologies, a world-leading solution provider of innovative, advanced and cost-effective Automated Machine Vision inspection system and equipment for the Semiconductor and Electronics packaging industries, is pleased to announce the appointment of Dieter Lang as the new Europe Regional Business Development Director ViTrox Technologies GmbH.

ViTrox Technologies

Koh Young SPI Dispenses Solder Paste for 0402M (01005) Microchips

Industry News | 2018-09-04 10:25:16.0

Seoul, South Korea – Flexible SMT production has entered into a new dimension. Koh Young Technology’s 3D SPI (Solder Paste Inspection) system has now expanded its solution to perform complex dispensing. Koh Young highlighted the latest innovations, including its new high-precision, integrated dispenser for the KY8030-3 3D SPI in Stand 1F45 at NEPCON South China, which occurred August 28-30, 2018 in Shenzhen, China.

Koh Young America, Inc.

Koh Young Unveils Advanced 3D Measurement, Process Solutions at APEX 2014

Industry News | 2014-03-19 13:27:35.0

Koh Young America and Koh Young Technology (Seoul, Korea) will demonstrate exciting new breakthroughs in PCB inspection at IPC/APEX 2014 in Las Vegas, Nevada this coming week.

Koh Young America, Inc.

New Nordson YESTECH Investment Takes MC Assembly’s Quality Inspection Capabilities to the Next Dimension

Industry News | 2017-03-29 07:39:45.0

Electronics Manufacturing Services Provider Invests in Upgraded 3D Inspection of Printed Circuit Board Assemblies.

Nordson YESTECH


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