Industry News | 2021-10-11 08:08:21.0
Koh Young, the industry leader in True3D™ measurement-based inspection solutions, announces the release of its new Meister D+ semiconductor inspection solution. Premium True3D™ Inspection Solution for Chiplets and System-in-Package (SiP) devices including die and surface mount components. The new Meister D+ is an extension of the Meister product family that features solutions ranging from solder paste, printed bumps, and solder ball to small components like 0201Ms and highly reflective die.
Industry News | 2012-03-24 10:06:28.0
NEPCON China Becomes a Platform for the Debut of New Product Releases in Asia
Industry News | 2024-03-18 11:39:20.0
We are showcasing our flagship All-in-One platforms FOX and PUMA. The machines will be equipped with the latest innovations in Solder Jetting, Integrated Inspection System, Smart Material Management, and 4 mm EVO feeder – 08004 Pick-and-Place.
Industry News | 2017-02-08 18:39:22.0
Yamaha IM America, in partnership with Trans-Tec Worldwide, will exhibit dynamic new SMT assembly technology in Booth #2317 at IPC/APEX 2017 next week.
Industry News | 2010-08-09 13:23:20.0
Vi TECHNOLOGY will be represented with its Chinese Agents to exhibit AOI solutions to reduce defective PCBAs at Nepcon South China Shenzhen from August 31st to September 2nd.
Industry News | 2021-06-09 04:34:32.0
Having acquired its fifth Europlacer iineo+ pick & place machine in late 2019, St Neots based contract electronics manufacturer OSI Electronics UK is now adding a new Europlacer screen printer and ALeader3D Solder Paste Inspection(SPI) combination to its reconfigured 'SMT Hall'.
