Industry News: dipping (Page 8 of 41)

SHENMAO Offers Halogen-Free SM-862 Liquid Flux

Industry News | 2022-02-25 13:23:30.0

SHENMAO America, Inc. is pleased to offer its halogen-free SM-862 Liquid Flux that can replace the widely sold halogenated SM-816. The flux features low solid content and smooth flux residue, making it suitable for automatic wave soldering and manual dipping processes.

Shenmao Technology Inc.

Electronic Component Orders Dip in July

Industry News | 2010-08-19 01:29:47.0

Electronic component orders dipped in July after reaching a two-year high in June, according to the monthly order index compiled by the Electronic Components Association (ECA). The 12-month average, comparing this year's results to last year's, continued an ascent that began last summer.

Electronic Components Industry Association (ECIA)

SHENMAO Features LED Die Bonding Solder Pastes at IPC APEX 2016

Industry News | 2016-03-10 18:40:47.0

SHENMAO proudly announces a series of Lead-free LED Die Bonding Solder Pastes made locally in the USA and with the same quality in 8 other worldwide locations for various Die Bonding processes. Powder Size is available from T3 to T8.

Shenmao Technology Inc.

Tinning wires and components faster and safer

Industry News | 2016-05-20 06:19:59.0

JBC launches a new dip soldering system to make your work easier.

JBC Soldering Tools

Seika Offers New Solder Paste Testing Solutions

Industry News | 2020-04-30 12:05:37.0

Seika Machinery, Inc. is pleased to offer the new PCU-285 Spiral Viscometer and DS-10S Dip Tester for Selective Solder from Malcom.

Seika Machinery, Inc.

SHENMAO Exhibits at ECTC in Las Vegas June 1-2, 2016 Booth # 505 Introduces PF606-P116 / PF606-P128 / PF606-XP LED Die Bonding Solder Pastes

Industry News | 2016-06-05 13:20:49.0

SHENMAO PF606-P116 Halogen Free Water Soluble LED Die Bonding Solder Pastes are made locally in the USA and with the same quality in 8 other worldwide locations.

Shenmao Technology Inc.

SHENMAO Exhibits at SEMICON WEST July 11-13, 2017 Booth # 5716 Introduces New Tacky Flux SMF-WC52 for Flip Chip Technology

Industry News | 2017-07-09 20:40:11.0

SHENMAO Technology, Inc. introduces New Generation Ultra Tacky Flux SMF-WC52 applied in the Flip Chip dipping process. Its high tacky property keeps Chip in place during reflow for excellent soldering performance, while creating outstanding solder joint strength.

Shenmao Technology Inc.

Seika Introduces New Solder Paste Testing Solutions at APEX

Industry News | 2020-01-07 11:22:42.0

Seika Machinery, Inc. today announced plans to exhibit at the 2020 IPC APEX EXPO, scheduled to take place Feb. 4-6, 2020 at the San Diego Convention Center in California. Seika will introduce the new PCU-285 Spiral Viscometer and DS-10S Dip Tester for Selective Solder from Malcom in Booth #3645.

Seika Machinery, Inc.

ePAK International Purchases Hentec/RPS Pulsar Solderability Test System

Industry News | 2021-10-25 10:56:34.0

Pulsar solderability test system determines how well molten solder will wet on solderable surfaces of electronic components

Hentec Industries, Inc. (RPS Automation)

Jade Micron Pte Ltd Installs Hentec/RPS Pulsar Solderability Test System in Singapore

Industry News | 2021-11-22 12:14:16.0

Pulsar solderability test system determines how well molten solder will wet on solderable surfaces of electronic components.

Hentec Industries, Inc. (RPS Automation)


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