Industry News | 2020-07-09 18:39:47.0
Seika Machinery, Inc. introduces the Malcom SWB-2 Wetting Balance Tester. The entire procedure from flux application (with flux temperature control function) to measurement end is automated.
Industry News | 2013-11-27 15:30:07.0
Martin introduced its new rework Process Shuttle that streamlines flux and solder paste dipping or printing, and pre-positions the smallest surface mountable devices (SMDs) for pickup. This enhancement to the company's EXPERT 10.6 rework system was designed to increase the efficiency and quality of the work performed.
Industry News | 2021-02-09 12:28:27.0
Odyssey 1325 provides high reliability BGA alloy exchange and component re-finishing capabilities
Industry News | 2015-10-07 11:27:38.0
SHENMAO will exhibit at IWLPC October 13-14 in San Jose, CA, USA – Booth No. 505
Industry News | 2017-02-01 15:58:45.0
SHENMAO America supports the SMTA by sponsoring the Luau & Reception at the Pan Pacific Microelectronics Symposium event held at the Sheraton Poipu Kauai Resort in Kauai, Hawaii.
Industry News | 2010-09-16 21:44:04.0
The Balver Zinn Group announces that Cobar Europe BV now distributes Yincae Advanced Materials’ SMT 158 Capillary Underfill and SMT 256 Individual Solder Joint Encapsulations throughout Europe.
Industry News | 2012-02-15 19:16:37.0
SMART Group will host a Webinar titled “Package on Package (PoP) Assembly Process & Inspection” on Thursday March 15, 2012 from 2:30-3:30 p.m. GMT.
Industry News | 2013-11-21 17:42:27.0
Ersa announced that it was awarded a 2013 Global Technology Award in the category of Soldering Equipment – Selective for its ECOCELL in combination with the FIFO TOWER C.
Industry News | 2014-05-13 17:01:55.0
Indium Corporation's Graham Wilson, applications engineer, will present at Brasage in Brest, France on Friday, May 23. Wilson's presentation, Elimination of Head-in-Pillow in PoP Assembly: A Flux Approach, discusses eliminating head-in-pillow defects in the package-on-package (PoP) assembly process by engineering unique attributes of the flux chemistries of dipping fluxes and pastes.
Industry News | 2016-06-01 15:30:00.0
Spokane Valley, Washington,— Hentec Industries, Inc. (formerly RPS Automation LLC), a manufacturer of precision soldering automation equipment for electronics assembly and manufacturing, today announced the release of the latest generation of solderability test systems; The Photon Steam Aging System and Pulsar Solderability Test System.
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