Industry News | 2009-05-26 18:16:29.0
In a remarkable breakthrough for underfill materials development, Henkel has engineered and launched a new underfill system that delivers on an unprecedented array of complex and demanding requirements, including room temperature fast flow, low temperature cure and reworkability. The new material, Hysol� UF3800�, has been specifically designed for use with today's CSP and BGA devices and is particularly well-suited for handheld communication and entertainment applications.
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