Industry News: dpak void specification ipc (Page 1 of 3)

IPC Releases Revision D for IPC-6012, Qualification and Performance Specification for Rigid Printed Boards

Industry News | 2015-09-30 10:08:42.0

IPC — Association Connecting Electronics Industries® has released IPC-6012D, Qualification and Performance Specification for Rigid Printed Boards. IPC delivers the most current specifications for rigid printed board requirements to the electronic industry. The newly updated revision D will be release in conjunction with IPC-6012DS, Space and Military Avionics Applications Addendum to IPC-6012D, Qualification and Performance Specification for Rigid Printed Boards, which addresses requirements for space and military avionics.

Association Connecting Electronics Industries (IPC)

Updates in IPC-6018B Help Engineers Design High-reliability Boards Specification addresses growing field of microwave technology

Industry News | 2012-05-04 09:21:15.0

As printed boards evolve and chip speeds increase, the use of microwave technology in commercial applications, such as cell phone towers and in military products, is expanding.

Association Connecting Electronics Industries (IPC)

IPC Surface Mount Equipment Manufacturers Association Council Issues Advisory on Counterfeit and Inferior Parts and Unlicensed Software

Industry News | 2011-06-16 13:19:38.0

Counterfeit products are reported to have grown to a $600 billion business worldwide. The electronics assembly industry has been impacted, with reports of counterfeit feeders, spare parts and software causing equipment breakdowns and production delays. To assist IPC member companies in keeping their equipment and lines running, the Surface Mount Equipment Manufacturers Association (SMEMA) Council of IPC – Association Connecting Electronics Industries® is creating an “anti-counterfeit tool kit.”

Association Connecting Electronics Industries (IPC)

Indium Corporation Names Silver Quill Award Winners

Industry News | 2019-01-16 20:44:36.0

Indium Corporation has acknowledged several of its employees with the annual Silver Quill Award.

Indium Corporation

Indium Corporation Experts to Present at IPC APEX Expo

Industry News | 2019-01-08 20:28:27.0

Several Indium Corporation technical experts will share their knowledge at the IPC APEX Expo in San Diego, Calif., USA, Jan. 29-31.

Indium Corporation

Indium Corporation to Feature Low-Voiding Solder Paste at IPC APEX 2016

Industry News | 2016-02-06 01:03:23.0

Indium Corporation will feature its void-reducing no-clean solder pastes to help customers Avoid the Void™ at IPC APEX Expo.

Indium Corporation

Indium Corporation’s Low-Voiding Solder Pastes Featured at IPC APEX 2016

Industry News | 2016-03-17 14:15:35.0

Manufacturers no longer have to settle for unacceptable levels of voiding when soldering QFNs, CSPs, or BGAs. Indium Corporation will help customers Avoid the Void™ with its void-reducing no-clean solder pastes at IPC APEX Expo.

Indium Corporation

Indium Corporation to Feature High-Reliability Products at CEIA Wuhan

Industry News | 2021-06-17 15:18:27.0

Indium Corporation will feature proven products from its portfolio of high-reliability solder materials at the CEIA Wuhan Seminar on June 24 in Wuhan, China.

Indium Corporation

Nordson DAGE and Rockwell Collins Co-author Technical Paper on Voiding in Ball Grid Arrays

Industry News | 2011-09-23 22:09:26.0

Nordson DAGE announces that a Technical Paper entitled "The Last Will and Testament of the BGA Void" will be presented at the SMTA International Conference & Exhibition.

Nordson DAGE

Domestic PCB Fabricator Certifies Nine Employees as IPC Application Specialists Per IPC-A-600

Industry News | 2013-03-18 11:42:51.0

Last week, in accordance with IPC-A-600, North American bare board manufacturer Saturn Electronics Corporation certified nine Michigan-based employees as IPC Application Specialists.

Saturn Electronics Corporation

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