Industry News: draing and solder (Page 13 of 138)

SMTA SE Asia Technical Conference Special Events Feature Tutorial and Plenary Sessions

Industry News | 2009-10-16 17:12:49.0

Penang, Malaysia – SMTA is proud to announce special events for the South East Asia Technical Conference on Electronics Assembly Technologies, to be held November 18-20, 2009 at the Equatorial Hotel in Penang, Malaysia.

Surface Mount Technology Association (SMTA)

IPC Offers Tech Ed Course on Utilizing J-STD-001 and IPC-A-620 Together Course to be taught in locations in U.S and Europe

Industry News | 2019-03-18 08:30:09.0

IPC’s popular standards, J-STD-001, recognized globally for its criteria on soldering processes and materials, and IPC-A-610, the most widely used electronics assembly acceptance document, complement each other when used together. IPC offers a new technical education course, Process and Acceptability Requirements: Utilizing J-STD-001 and IPC-A-610 Together, to provide instruction on how best to use these documents jointly.

Association Connecting Electronics Industries (IPC)

IPC J-STD-001E Released: Industry Requirements for Soldered Electrical and Electronic Assemblies Updated

Industry News | 2010-04-10 02:07:54.0

IPC has released the E revision of IPC J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies. Recognized worldwide as the sole industry-consensus standard for soldering processes and materials, IPC J-STD-001E encompasses advanced technologies and provides new and updated criteria for all three classes of construction as well as expanded support for lead-free manufacturing.

Association Connecting Electronics Industries (IPC)

Update of IPC J-STD-609 Provides Greater Delineation of Lead-free Solders for Marking and Labeling

Industry News | 2010-04-10 02:05:54.0

IPC released today the A revision of IPC J-STD-609, Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Lead-Free (Pb-Free) and Other Attributes. This standard presents a marking and labeling system that aids in electronics assembly, rework, repair and recycling, and now provides additional codes for the more precise specification of certain lead-free solders.

Association Connecting Electronics Industries (IPC)

Webtorial: Design and Assembly Process Challenges for Bottom Terminations Components (BTCs) such as QFN, DFN and MLF in Tin-Lead & Lead Free World

Industry News | 2013-01-02 16:01:34.0

A Convenienient and informative online tutorial about Design and Assembly Process Challenges for Bottom Terminations Components

Surface Mount Technology Association (SMTA)

Lead Free Solders and Embedded Passives Headline Professional Development Schedule at 2003 IPC Annual Meeting

Industry News | 2003-07-08 09:48:46.0

taking place September 28-October 2, at the Minneapolis Convention Center in Minneapolis, Minn.

Association Connecting Electronics Industries (IPC)

14th Annual Pan Pacific Microelectronics Symposium Registration Open and Program Announced

Industry News | 2008-10-13 18:04:29.0

Minneapolis, MN � Registration is now open and the program is finalized for the 14th Annual Pan Pacific Microelectronics Symposium & Exhibit taking place February 10 - 12, 2009 at the Hapuna Beach Prince Hotel on the Big Island of Hawaii. The conference promotes international technical interchange and provides a premier forum for extensive networking among industry professionals and business leaders throughout the world.

Surface Mount Technology Association (SMTA)

AIMS Harsh Environments Symposium To Address Thermo-Mechanical Analysis, Metallization, and Reliability of Lead-Free Solders

Industry News | 2011-07-14 11:02:39.0

The SMTA announced that the AIMS Harsh Environments Symposium will be held on October 17, 2011 as a focused symposium at SMTA International in Ft. Worth, TX.

Surface Mount Technology Association (SMTA)

International Conference on Soldering and Reliability (ICSR) Best of Conference Announced

Industry News | 2013-06-26 09:09:19.0

The SMTA announced Harald Grumm from Christian Koenen GmbH as the recipient of the Best of Conference Award for his presentation “The Potential of Stencil Technology – Choosing the Right Stencil Options to Maximize Yield and Earnings” at the 9th Annual International Conference on Soldering and Reliability, held May 14-17, 2013 at the Sheraton Toronto Airport, Ontario, Canada.

Surface Mount Technology Association (SMTA)


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