Industry News: dry film laminators (Page 1 of 14)

Shipley Company Announces Distribution Agreement with Unichem Industries

Industry News | 2003-04-18 08:31:57.0

Unichem to enhance its support and service for North American dry film photoresist and soldermask lamination equipment customers.

SMTnet

DuPont Electronic Technologies To Appoint Insulectro as National Distributor for Circuit Materials

Industry News | 2003-06-16 08:33:59.0

This action is part of the DuPont strategy to build on its leadership position in circuit materials, by expanding and strengthening the level of service and support available to its customers.

SMTnet

DuPont Electronic Technologies' Printed Circuit Materials Division Announces Price Increase for Riston� Photopolymer Dry Film Resists

Industry News | 2003-06-04 08:27:58.0

DuPont cites rising raw material, transportation and energy costs as reasons for the increase.

SMTnet

Rogers Corp. Introduces R/flex� 3850 Bi-Clad Liquid Crystalline Polymer Material for Multi-layer Thin-Film PCB Construction

Industry News | 2003-06-24 08:14:51.0

R/flex� 3850 laminate is produced in a range of copper and LCP thicknesses, just as the single-clad laminate, and is available in standard panel formats.

SMTnet

DuPont Electronic Technologies Highlights Interra� Embedded Passives Technology at IPC Expo

Industry News | 2003-03-24 09:46:41.0

Will feature a number of new technologies of interest to fabricators in printed circuit materials, laminate materials, polymer thick films and, most notably, its newest product line of embedded passive materials, DuPont Interra�.

SMTnet

Taiyo America Announces Partnership Alliance

Industry News | 2003-03-31 09:43:08.0

With Schedectady International to develop, manufacture, and sell waterborne photoimagable etch resists and soldermasks in North America.

SMTnet

Three Sun Multilayer PCB Accommodates 0.5mm(�) Holes

Industry News | 2003-05-19 10:06:43.0

The PCB is available with a maximum panel size of 406-by-460mm and a minimum board thickness of 0.8mm.

SMTnet

Tessera Introduces PYXIS� Packaging Technology - World's First Chip-Scale Packaging Solution for Highly Integrated RF Modules

Industry News | 2003-04-15 08:57:18.0

First Implementation of the Package Platform Delivers 50-percent Cost, 60-percent Height, and 75-percent Area Reductions over Conventional RF Module Technologies

SMTnet

New IPC APEX EXPO™ Solar Assembly and Solar Living Pavilion Lights Up Growing Opportunities for EMS Industry

Industry News | 2011-02-24 21:39:40.0

The assembly of solar panels is very similar to the assembly of printed boards, making solar power a hot opportunity for electronics assemblers. A small but growing market, solar module production is projected to increase 273% from 2010 to 2014, according to iSuppli. Shedding some light on the rapidly advancing business of solar panel assembly, IPC will host the Solar Assembly and Solar Living Pavilion on the show floor at IPC APEX EXPO, April 12–14, 2011, in Las Vegas.

Association Connecting Electronics Industries (IPC)

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Industry News | 2018-12-08 03:29:29.0

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Flason Electronic Co.,limited

  1 2 3 4 5 6 7 8 9 10 Next

dry film laminators searches for Companies, Equipment, Machines, Suppliers & Information