Industry News: dual lane p (Page 8 of 30)

Hanwha Receives 2024 NPI Award for High-Speed Dual Lane Chip Mounter

Industry News | 2024-03-11 18:12:33.0

Hanwha Techwin Automation Americas is pleased to announce that its XM520 High-Speed Dual Lane Chip Mounter has been honored with the 2024 NPI Award in the Component Placement - High-Speed category. Recognized for its best-in-class speed and applicability, the XM520 sets a new standard of flexibility in surface mount technology (SMT) and through-hole technology (THT) production.

Hanwha Techwin CO., LTD.

New Modular Mounter from Juki – RX-6

Industry News | 2014-01-23 17:48:44.0

Juki Automation Systems (JAS), Inc.introduces its new RX-6 – a new modular mounter that combines high quality, flexibility and productivity.

Juki Automation Systems

Fuji Expands Printer Line-up with NXTP-M35

Industry News | 2013-01-22 01:29:07.0

Fuji has released the NXTP M35 printer, which expands the supported panel size of this printer series to 350 x 300 mm (13.7 x 11.8 inches). The latest addition to the Fuji line-up has all the benefits of the previously released NXTP M25, but with a wider body for handling medium sized panels.

FUJI CORPORATION

BTU International Receives Multiple-Unit Order for Tritan Metallization Firing Systems

Industry News | 2010-08-24 11:45:56.0

BTU International, a leading supplier of advanced thermal processing equipment for the alternative energy and electronics manufacturing markets, today announced the receipt of an order from a customer in Asia for multiple Tritan™ metallization firing systems. All of the units are scheduled to be shipped in the second half of this year.

BTU International

BTU International to Feature Next-Generation Thermal Processing Capabilities at PV Taiwan

Industry News | 2011-09-12 13:09:23.0

BTU International will highlight its next-generation thermal processing capabilities in booth #1305 at the PV Taiwan International Photovoltaic Forum & Exhibition.

BTU International

MPM® Momentum® Compact Printer Boosts Throughput with Back-to-Back Configurability

Industry News | 2013-08-07 10:33:35.0

2) to maximize yields and product quality. In fact, the Momentum Compact delivers the highest throughput for its footprint in the industry.

Speedline Technologies, Inc.

CyberOptics Integrates Advanced MRS Technology into New SE3000™ 3D Solder Paste Inspection System

Industry News | 2017-11-09 15:53:54.0

CyberOptics® Corporation will demonstrate the new SE3000™ 3D Solder Paste Inspection (SPI) system with a proprietary Multiple-Reflection Suppression (MRS) Sensor in Hall A2, Stand 439 at productronica 2017, scheduled to take place Nov. 14 – 17, 2017 at the Messe München, in Germany.

CyberOptics Corporation

Yamaha to Showcase Winning SMT Assembly Systems at SMTAI 2017

Industry News | 2017-08-01 06:32:47.0

Yamaha Motor Corporation will exhibit dynamic new SMT assembly technology in booth #1023 at the upcoming SMTAI International Conference and Exhibition, September 19 & 20 at the Donald Stephens Convention Center in Rosemont, IL. The equipment being shown will include the YSM20 Modular Mounter, the YSP printer, and YSiV software.

Yamaha Motor IM America, Inc.

AIMEX II Announced

Industry News | 2013-04-22 19:51:29.0

The all-in-one placement machine AIMEX II has been developed. The AIMEX II inherits concepts from the popular AIMEX, but with increased flexibility and expandability.

FUJI CORPORATION

Electronics Manufacturers to Gather in Shenzhen With Numerous Exhibits Targeted at the Industry Hotspots

Industry News | 2012-08-15 12:25:12.0

NEPCON South China 2012 will take place between August 28 and August 30, 2012 at the Shenzhen Convention & Exhibition Center

Reed Exhibitions


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