Industry News: dummy bga packages (Page 1 of 55)

Investment Boosts SMT Placement and Rework

Industry News | 2003-06-04 09:19:23.0

With increasing demand for fine pitch placements and a growing amount of fast turnaround high-tech low-volume prototype work, Speedboard has invested in additional SMT/BGA placement/rework equipment.

SMTnet

Tessera Introduces PYXIS� Packaging Technology - World's First Chip-Scale Packaging Solution for Highly Integrated RF Modules

Industry News | 2003-04-15 08:57:18.0

First Implementation of the Package Platform Delivers 50-percent Cost, 60-percent Height, and 75-percent Area Reductions over Conventional RF Module Technologies

SMTnet

Nextek Expands Production Operations

Industry News | 2003-06-25 12:49:17.0

Additional state of the art automated surface mount assembly equipment has been installed to provide expanded capacity for advanced technology printed circuit assemblies

SMTnet

Circuit World Announces License of Channel Routing Technology from Nortel Networks

Industry News | 2003-06-25 12:40:26.0

to manufacture and market printed circuit boards utilizing PCB Channel Routing technology from Nortel Networks

SMTnet

Practical Components to Highlight Latest Technology at SMTA International 2007

Industry News | 2007-10-04 23:11:30.0

LOS ALAMITOS, CA - September 25, 2007 - Practical Components, a leading international distributor of mechanical IC samples or �dummy� components and SMD production tools and equipment, announces that it will display its latest technology in booth 510 at the upcoming SMTA International exhibition and conference, scheduled to take place October 7-11, 2007, in Orlando, FL.

Surface Mount Technology Association (SMTA)

SMTA Boston Offers Flip Chip and BGA Workshop

Industry News | 2003-03-20 09:03:05.0

Organizing a Flip Chip and BGA Packaging Technologies Workshop as a part of the SMTA Boston 2003 Conference (June 9-11) at the Bayside Convention Center in Boston, Massachusetts.

Surface Mount Technology Association (SMTA)

Ball Grid Array (BGA) Package

Industry News | 2018-12-08 03:31:22.0

Ball Grid Array (BGA) Package

Flason Electronic Co.,limited

SMTA Boston Workshop, Courses, and Special Events

Industry News | 2003-04-21 09:12:57.0

June 9-11 at the Bayside Convention Center

Surface Mount Technology Association (SMTA)

What is a Ball Grid Array?

Industry News | 2018-10-18 10:22:15.0

What is a Ball Grid Array?

Flason Electronic Co.,limited

Precision PCB Services, Inc. will exhibit at the International Wafer-Level Packaging Conference Exhibition

Industry News | 2019-10-16 11:15:35.0

Precision PCB Services, Inc. will Exhibit at the International Wafer-Level Packaging Conference Exhibition on October 23 - 24, 2019 at the Double Tree Hotel, 2050 Gateway Place, San Jose, CA

Precision PCB Services, Inc

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