Industry News | 2003-04-08 10:28:06.0
A new range of high-performance press-fit D-subminiature terminations from GTK can be fitted easily to PCBs without the need for solder.
Industry News | 2016-04-20 10:27:40.0
BEST, Inc. was presented Circuit Assembly’s NPI Award for its HeatShield Gel™ high temperature shielding product at the IPC APEX Expo on Feb. 24 in San Diego, Calif.
Industry News | 2019-11-05 22:19:03.0
> News-Blog > Guideline for wire bonding Guideline for wire bonding Tuesday,Jun 12,2018 There are two wire bonding processes that are used, Thermosonic (T/S) Gold Ball Wire Bonding and Ultrasonic (U/S) Aluminum Wedge Wire Bonding. Approximately 90% of all IC Assembly in Semiconductor Packages is manufactured using Gold Ball Bonding process, while Aluminum Wedge Bonding is used to produce about 10% of other Wire Bonding requirements on Printed Circuit Boards (PCB), Printed Circuit Flex (PCF) and other Packages.
Industry News | 2004-04-27 15:19:57.0
Zymet has introduced a new reworkable underfill encapsulant, CN-1453, designed for BGA encapsulation. Removal of defective BGA's is easily accomplished by heating the component and the underfill encapsulant to 220°C. Underfill encapsulant residues are easily scraped or brushed off.
Industry News | 2009-09-17 17:02:12.0
EAST HANOVER, NJ – Zymet has introduced a new reworkable underfill encapsulant, CN-1728, designed to underfill Package-on-Package (POP) assemblies. Underfilled POP’s have greater difficulty in passing thermal cycle tests than underfilled BGA’s. Compared to earlier generation underfills, CN-1728 has a lower coefficient of thermal expansion and higher Tg, and better compatibility with flux residues, both of which contribute to its superior thermal cycle performance.
Industry News | 2016-08-17 09:26:56.0
AI Technology, Inc. (AIT) manufactures a series of temporary bonding materials for processing temperatures up to 150 Cº. They are well accepted for grinding, dicing, etching, and deposition. AIT customers prefer AIT bonding materials over conventional wax materials specifically because AIT’s products feature ease of use and quick removal, especially for very delicate compound wafers and photonics.
Industry News | 2013-04-24 11:30:42.0
MARTIN is announces that Infrared temperature (IR) measurement sensors now are available on its EXPERT 10.6 Rework Systems
Industry News | 2017-05-20 15:06:05.0
PCB array panelization can be a major challenge for PCB designers. Learn best practices for designing PCB boards for most efficient panelization.
Industry News | 2003-09-25 13:32:47.0
Reduce waste and cost.
Industry News | 2016-03-03 10:53:58.0
AdoptSMT over the last 20+ years has become Europe's largest supplier of pre-owned electronic production equipment. AdoptSMT have specialised centres throughout Europe in all types of production equipment, and they can offer everything from single feeders to a total turnkey system.
