Industry News | 2012-02-10 16:26:39.0
Multitest announces that Ryan Satrom, RF Engineer, will present a paper titled “Improving Power Delivery In The Test Interface” at the upcoming Burn-in & Test Socket Workshop.
Industry News | 2015-08-20 14:42:21.0
Noise transmitted on the line and neutral conductors coming from equipment under test can now easily be measured.
Industry News | 2010-07-22 22:33:39.0
Multitest announces that it has designed differential contactors that are customized for each semiconductor test application. The selection of the contactor materials and probes are optimized for the desired impedance.
Industry News | 2010-08-27 22:49:53.0
Multitest announces that its Gemini™ series contactors have been chosen by another major semiconductor IDM as the contactor of choice for QFN packages. Gemini™ outperformed the competition in multiple categories over months of evaluation.
Industry News | 2016-05-13 11:56:03.0
The process of manufacturing and qualifying IC's consists of many steps while Temperature forcing systems play a crucial role in the final testing process. These environmental tests assure quality and reliability by stressing the device on one hand as well as helping to characterize and validate it on the other hand (making sure manufacturing outcome meets the design requirements). At later stages the temperature testing can support failure analysis effort and root cause analysis. AS common practice we are dealing with few different kinds of temperature forcing systems: Chambers, Thermal Stream systems and Direct Thermal Head systems. In this article I would like to focus on the practical aspects of utilizing Thermal Stream systems and Direct Thermal Head systems.
Industry News | 2021-10-07 15:42:42.0
Seica will be exhibiting at the SMTA International show in Minneapolis, MN on November 1-4, 2021 in booth 3432. On display will be our flagship Pilot V8, undoubtedly the most extensive flying probing test platform on the market. This system will be demonstrating full In-circuit testing as well as on-board programming, using Seica's innovative Device Clip programmer and integrated Flypod option, which ensures quick, reliable connection to any connector or programmable device on the DUT. To enhance test coverage where traditional ICT test methods may not be used, the Flypod can also provide access to the DUT for 3rd party Boundary Scan test solutions, to perform cluster tests and run BSD files. The system on display will also showcase its power up test capability, which enables many additional test techniques to be applied, such as LED testing. In addition, Seica's QuickTest software environment allows the user to easily generate and incorporate functional test routines within full ICT test programs.
Industry News | 2010-02-18 11:28:18.0
Rosenheim, February 2010: Multitest, a leader in temperature test, has developed a dedicated set up for the MT9928 gravity handler to allow for calibrating temperature sensors.
Industry News | 2011-05-06 20:47:45.0
Multitest announces that the MT9510 now provides extended temperature control with its extended temperature calibration (XTC).
Industry News | 2012-08-08 17:30:37.0
Multitest, now offers the MT2168 with optional 2D code reader to ensure 100 percent device traceability and lot integrity
Industry News | 2016-05-13 12:00:12.0
The process of manufacturing and qualifying IC's consists of many steps while Temperature forcing systems play a crucial role in the final testing process. These environmental tests assure quality and reliability by stressing the device on one hand as well as helping to characterize and validate it on the other hand (making sure manufacturing outcome meets the design requirements). At later stages the temperature testing can support failure analysis effort and root cause analysis. AS common practice we are dealing with few different kinds of temperature forcing systems: Chambers, Thermal Stream systems and Direct Thermal Head systems. In this article I would like to focus on the practical aspects of utilizing Thermal Stream systems and Direct Thermal Head systems.
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