Industry News: dynamic (Page 3 of 89)

MIRTEC to Exhibit the Revolutionary APLHA 3D AOI System in the 3D AOI Arena, productronica 2019

Industry News | 2019-10-16 14:45:19.0

MIRTEC announces that the company will premier its all-new ALPHA 3D Automated Optical Inspection System at productronica 2019. New to this event, Messe München and Konradin Verlag have organized a 3D AOI Arena in Hall A2. Leading 3D AOI manufacturers such as MIRTEC will demonstrate their latest 3D Inspection Technology at this four-day event scheduled to take place Nov. 12-15, 2019, at the Munich Trade Fair Center in Munich, Germany.

MIRTEC Corp

Center for Electronics Manufacturing and Assembly Receives Automated Optical Inspection Equipment

Industry News | 2020-04-11 14:25:00.0

Increased capabilities in lab will support increased research and training opportunities in photonic

MIRTEC Corp

MIRTEC and Optel Software Implement Full AOI-MES CFX Integration at VIRTEX

Industry News | 2021-06-15 04:22:53.0

IPCs Connected Factory Exchange (CFX) standard defines communication between processes and devices for Industry 4.0. MIRTEC and Optel Software worked together to develop a CFX based interface between MIRTEC's AOI machines and Optel Software's MES system. The goal was to implement full AOI process control at test it at their mutual customer site, VIRTEX plant in Dallas, TX. The resulting CFX interface is vendor independent and will allow MIRTEC to interface with other MES systems, and Optel Software to interface with other AOI machines, with no changes. 

MIRTEC Corp

DDI Corp. Provides Update on Negotiations with it's Senior Lenders and Convertible Noteholders

Industry News | 2003-04-04 08:46:37.0

Company Announces Further Reductions to Goodwill and Reclassifications of Indebtedness Recorded in Fiscal 2002

SMTnet

MIRTEC to Display the 'World's Most Technologically Advanced' 3D AOI System at Productronica 2023

Industry News | 2023-10-16 12:50:01.0

MIRTEC announces the release of their All-New ART Hybrid 3D AOI System at Productronica 2023. The World's leading trade fair for the electronics manufacturing industry will take place Nov. 14-17, 2023, at the Trade Fair Center Messe München, Germany. All are welcome to MIRTEC's Booth #461 in Hall A2 for a detailed demonstration of what will undoubtedly be recognized as the World's Most Technologically Advanced 3D AOI System!

MIRTEC Corp

ITW EAE Wins VA Excellence Award for the Camalot Prodigy’s Dynamic Dual Head Dispensing Technology

Industry News | 2019-05-01 20:22:28.0

ITW EAE is proud to announce that it has earned a coveted VA Excellence Award for the Patented Dynamic Dual Head (DDH) dispensing technology for the Camalot Prodigy Dispenser. The Award was presented during the 13th Vision Awards program at Nepcon China.

ITW EAE

ITW EAE Wins Global Technology Award for the Camalot Prodigy's Dynamic Dual Head Dispensing Technology

Industry News | 2020-04-14 18:17:46.0

ITW EAE has earned a coveted Global Technology Award for the Patented Dynamic Dual Head (DDH) dispensing technology for the Camalot Prodigy Dispenser. The Award was presented to Camalot Prodigy Business Manager, Hugh Reed and Engineering Manager Scott Reid during a ceremony at Productronica in Munich Germany.

ITW EAE

ITW EAE Receives Patent No. 10,434,537 for Camalot® Prodigy's™ Dynamic Dual Head™ Dispensing Technology

Industry News | 2020-04-14 18:22:06.0

The U.S. Patent and Trademark Office has issued Patent No. 10,434,537 protecting Dynamic Dual Head™ (DDH) dispensing technology for the Camalot® Prodigy™ Dispenser. The Prodigy Dispenser employs breakthrough technology that delivers high-speed, extremely accurate materials dispensing for electronics assembly and packaging with tighter tolerances, and higher yields.

ITW EAE

ITW EAE Introduces Auto Exit Wing Feature for Electrovert® Wave Soldering Machines

Industry News | 2022-11-21 15:50:26.0

ITW EAE is releasing a new feature for the Electrovert Wave Soldering machines that provides automatic adjustment of the laminar wave flow to match the board velocity. To fully optimize the flow dynamics of the laminar wave, the velocity of the PCB needs to equal the flow of the solder over the weir of the exit wing. When the wave flow is fully optimized, the PCB 'peels' away from the solder which minimizes the opportunity for bridging defects to occur.

ITW EAE

IPC Releases New Industry Statistics

Industry News | 2001-12-12 07:28:23.0

IPC has announced the creation of the PCB Business Report, a new IPC statistical report tracking the dynamics of the U.S. Printed Circuit Board industry. The PCB Business Report, scheduled to be published for the first time on February 28, 2002, will be presented monthly, in addition to the IPC Book-to-Bill ratio.

Association Connecting Electronics Industries (IPC)


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