Industry News | 2012-09-04 08:51:32.0
Hesse & Knipps, Inc., (www.hesse-knipps.com) has added the HBK08 Loop Former Bondhead to its BONDJET BJ935 and BONDJET BJ939 fully automatic heavy wire bonders to support growing requirements for high density module bonding.
Industry News | 2012-08-14 10:24:59.0
Hesse & Knipps, Inc., (www.hesse-knipps.com) has appointed CWI Technical Sales as its representative along the United States East Coast (states of CT, MA, RI, VT, ME, NH, NY, NJ, DE, MD, PA, WV, VA, NC, SC, GA and FL) as well as the Canadian provinces of Quebec and Ontario
Industry News | 2021-07-08 05:33:04.0
Laserssel Co., LTD is pleased to introduce its CLSR 6000 high-end Laser Compression Bonder for semiconductor packages. This soldering technique uses high accuracy compression tools and Area Laser bonding introduced with LSRTM(Laser Selective Reflow) in order to minimize warpage on extremely thin packages and substrates. This technology has been adopted for high-end 2.5D packaging with dimensions larger than 60x60mm and NAND modules thinner than 50 µm.
Industry News | 2021-11-03 13:33:10.0
Laserssel Co., LTD is pleased to announce that it received two 2021 Mexico Technology Awards in the categories of Bonding Equipment for its LCB 3000 Laser Compression Bonder and Rework & Repair for its Laserssel rLSR Mini LED Rework System. The awards were announced during a ceremony that took place Wednesday, Nov. 3, 2021 during SMTA International in Minneapolis, MN.
Industry News | 2011-06-01 23:22:00.0
Finetech announces that it sold 12 bonding systems within the past year to prominent university labs and research centers. Of the 12, three systems were purchased by California universities, including a Nanofabrication Facility as well as Electrical Engineering and Physics departments.
Industry News | 2010-02-19 09:45:37.0
Pressurex® Sensor Film Needed to Measure Contact Pressure In Ultrasonic Welding
Industry News | 2015-10-05 18:40:58.0
The Condor, MTS 505 is the latest generation of flying probe test system from Digitaltest. The system now provides support for larger and heavier boards. When combined with our latest measurement hardware it can provide even higher test coverage while keeping maintenance requirements extremely low. With new sophisticated software, new hardware innovations, comprehensive boundary scan integrations (JTAG Technologies/Göpel Electronic) and new flying and opens check probes, the new Condor MTS 505 is equipped for the future of fixtureless testing.
Industry News | 2010-09-29 23:17:20.0
Cobra is one of the most modern SMD pick-and-place systems in the world. Latest drive and material technologies combined with quick changeover concepts make it an extremely reliable, fast and flexible workhorse for both high-volume and high-variety production.
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